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NTD24N06

MOSFET 24V 60A N-Channel

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SeekIC No. : 00163579 Detail

NTD24N06: MOSFET 24V 60A N-Channel

NTD24N06 Data Sheet

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Part Number:
NTD24N06
Mfg:
ON Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 27 A
Resistance Drain-Source RDS (on) : 42 mOhms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : DPAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : DPAK
Packaging : Tube
Drain-Source Breakdown Voltage : 60 V
Continuous Drain Current : 27 A
Resistance Drain-Source RDS (on) : 42 mOhms


Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits


Pinout

Connection Diagram


Specifications

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
60
Vdc
Drain−to−Gate Voltage (RGS = 10 M)
VDGR
60
Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp10 ms)
VGS
VGS
±20
±30
Vdc
Drain Current
− Continuous @ TA = 25°C, TJ = 150°C
− Continuous @ TA = 25°C, TJ = 175°C
− Continuous @ TA = 100°C, TJ = 175°C
− Single Pulse (tp10 s), TJ = 175°C
ID
ID
ID
IDM
24
27
19
80
Adc
Adc
Adc
Apk
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
PD
62.5
0.42
1.88
1.36
W
W/°C
WW
Operating and Storage Temperature Range
TJ, Tstg
−55 to
+175
°C
Single Pulse Drain−to−Source Avalanche Energy
− Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 Vdc,
L = 1.0 mH, IL(pk) = 18 A, VDS = 60 Vdc)
EAS
162
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RJC
RJA
RJA
2.4
80
110
°C/W
Maximum Lead Temperature for Soldering Purposes,
1/8 from case for 10 seconds
TL
260
°C
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR−4 board using the minimum recommended pad size.


Description

 NTD24N06 Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.




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