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NTD23N03R

MOSFET 25V 23A N-Channel

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SeekIC No. : 00166613 Detail

NTD23N03R: MOSFET 25V 23A N-Channel

NTD23N03R Data Sheet

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Part Number:
NTD23N03R
Mfg:
ON Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 25 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 4.5 A
Resistance Drain-Source RDS (on) : 45 mOhms Configuration : Single
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : DPAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Drain-Source Breakdown Voltage : 25 V
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Mounting Style : SMD/SMT
Package / Case : DPAK
Maximum Operating Temperature : + 150 C
Packaging : Tube
Continuous Drain Current : 4.5 A
Resistance Drain-Source RDS (on) : 45 mOhms


Features:

• Pb−Free Packages are Available
• Planar HD3e Process for Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Ciss to Minimize Driver Loss
• Low Gate Charge
• Optimized for High Side Switching Requirements in High−Efficiency DC−DC Converters


Pinout

Connection Diagram


Specifications

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
25
Vdc
Gate−to−Source Voltage − Continuous
VGS
±20
Vdc
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ TC = 25
Drain Current
− Continuous @ TC = 25, Chip
− Continuous @ TC = 25,Limited by Package
− Single Pulse
RJC
PD

ID
ID
IDM
5.6
22.3

23
17.1
40
/W
W

A
A
A
Thermal Resistance − Junction−to−Ambient (Note 1)
Total Power Dissipation @ TA = 25
Drain Current − Continuous @ TA = 25
RJA
PD
ID
76
1.64
4.5
/W
W
A
Thermal Resistance − Junction−to−Ambient (Note 2)
Total Power Dissipation @ TA = 25
Drain Current − Continuous @ TA = 25
RJA
PD
ID
110
1.14
3.8
/W
W
A
Operating and Storage Temperature Range
TJ, Tstg
−55 to +150
Maximum Lead Temperature for Soldering
Purposes, 1/8" from case for 10 seconds
TL
260

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended pad size.


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