NTD20N06 Selling Leads, Price trend , ON Semiconductor, NTD20N06 DataSheet download, circuit diagram from SeekIC.com

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NTD20N06: MOSFET 60V 20A N-Channel

NTD20N06 Data Sheet

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Part Number:: NTD20N06
Mfg:: ON Semiconductor
Supply Ability:: 5000

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Transistor Polarity :	N-Channel	Drain-Source Breakdown Voltage :	60 V
Gate-Source Breakdown Voltage :	+/- 20 V	Continuous Drain Current :	20 A
Resistance Drain-Source RDS (on) :	46 mOhms	Configuration :	Single
Maximum Operating Temperature :	+ 175 C	Mounting Style :	SMD/SMT
Package / Case :	DPAK	Packaging :	Tube

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : DPAK
Packaging : Tube
Continuous Drain Current : 20 A
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 46 mOhms

Features:

• Pb−Free Packages are Available
• Lower R_DS(on)
• Lower V_DS(on)• Lower Capacitances
• Lower Total Gate Charge
• Lower and Tighter V_SD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge

Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits

Pinout

Connection Diagram

Specifications

Rating	Symbol	Value	Unit
Drain−to−Source Voltage	V_DSS	60	Vdc
Drain−to−Gate Voltage (R_GS = 10 M)	V_DGR	60	Vdc
Gate−to−Source Voltage − Continuous − Non−Repetitive (t_p10 ms)	V_GS V_GS	±20 ±30	Vdc
Drain Current − Continuous @ T_C= 25 − Continuous @ T_C = 100 − Single Pulse (t_p10 s)	I_D I_D I_DM	20 10 60	Adc Apk
Total Power Dissipation @ T_C= 25 Derate above 25 Total Power Dissipation @ T_C= 25 (Note 1) Total Power Dissipation @ T_C= 25 (Note 2)	P_D	60 0.40 1.88 1.36	W W/ W W
Operating and Storage Temperature Range	T_J, T_stg	−55 to +175
Single Pulse Drain−to−Source Avalanche Energy − Starting T_J= 25 (V_DD = 25 Vdc, V_GS = 10 Vdc, L = 1.0 mH I_L(pk) = 18.4 A, V_DS = 60 Vdc)	E_AS	170	mJ
Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2)	R_JC R_JA R_JA	2.5 80 110	/W
Maximum Lead Temperature for Soldering Purposes, 1/8" from case for 10 seconds	T_L	260

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. When surface mounted to an FR4 board using the minimum recommended pad size.
2. When surface mounted to an FR4 board using the 0.5 sq in drain pad size.

Description

NTD20N06 Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.

NTD20N06

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