NTB75N06

MOSFET 60V 75A N-Channel

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SeekIC No. : 00165645 Detail

NTB75N06: MOSFET 60V 75A N-Channel

floor Price/Ceiling Price

Part Number:
NTB75N06
Mfg:
ON Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2025/1/8

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 75 A
Resistance Drain-Source RDS (on) : 9.5 mOhms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : D2PAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : D2PAK
Packaging : Tube
Drain-Source Breakdown Voltage : 60 V
Resistance Drain-Source RDS (on) : 9.5 mOhms
Continuous Drain Current : 75 A


Features:

• Pb−Free Packages are Available


Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits



Specifications

 Rating  Symbol  Value  Unit
 Drain−to−Source Voltage  VDSS  60  Vdc
 Drain−to−Gate Voltage (RGS = 10 M)  VDGR  60  Vdc
 Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp10 ms)
VGS
VGS
±20
±30
 Vdc
 Drain Current
− Continuous @ TA = 25
− Continuous @ TA = 100
− Single Pulse (tp10 µs)
 ID
ID
IDM
 75
50
255
 Adc
Apk
 Total Power Dissipation @ TA = 25
Derate above 25
Total Power Dissipation @ TA = 25(Note 1)
 PD 214
1.4
2.4
 W
W/
W
 Operating and Storage Temperature Range  TJ, Tstg  −55 to
+175
 
 Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25
(VDD = 75 Vdc, VGS = 10 Vdc, L = 0.3 mH
IL(pk) = 55 A, VDS = 60 Vdc)
 EAS  884  mJ
 Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
 RJC
RJA
0.7
62.5
 /W
 Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds
 TL  260  

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.




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