NTB60N06

MOSFET 60V 60A N-Channel

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SeekIC No. : 00166246 Detail

NTB60N06: MOSFET 60V 60A N-Channel

floor Price/Ceiling Price

Part Number:
NTB60N06
Mfg:
ON Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/10/30

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 60 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 60 A
Resistance Drain-Source RDS (on) : 14 mOhms Configuration : Single
Maximum Operating Temperature : + 175 C Mounting Style : SMD/SMT
Package / Case : D2PAK Packaging : Tube    

Description

Transistor Polarity : N-Channel
Gate-Source Breakdown Voltage : +/- 20 V
Configuration : Single
Maximum Operating Temperature : + 175 C
Mounting Style : SMD/SMT
Package / Case : D2PAK
Packaging : Tube
Drain-Source Breakdown Voltage : 60 V
Continuous Drain Current : 60 A
Resistance Drain-Source RDS (on) : 14 mOhms


Features:

• Pb−Free Packages are Available




Application

• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits



Specifications

 Rating  Symbol  Value  Unit
 Drain−to−Source Voltage  VDSS  60  Vdc
 Drain−to−Gate Voltage (RGS = 10 M)  VDGR  60  Vdc
 Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp10 ms)
VGS
VGS
±20
±30
 Vdc
 Drain Current
− Continuous @ TA = 25
− Continuous @ TA = 100
− Single Pulse (tp10 µs)
 ID
ID
IDM
 60
42.3
180
 Adc
Apk
 Total Power Dissipation @ TA = 25
Derate above 25
Total Power Dissipation @ TA = 25(Note 1)
 PD  150
1.0
2.4
 W
W/
W
 Operating and Storage Temperature Range  TJ, Tstg  −55 to
+175
 
 Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25
(VDD = 75 Vdc, VGS = 10 Vdc, L = 0.3 mH
IL(pk) = 55 A, VDS = 60 Vdc)
 EAS  454  mJ
 Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
 RJC
RJA
 1.0
62.5
 /W
 Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds
 TL  260  

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.

1. When surface mounted to an FR4 board using minimum recommended pad size, (Cu Area 0.412 in2).



Description

 NTB60N06 Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.


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