Features: • Higher Current Rating• Lower R DS(on)• Lower Capacitances• Lower Total Gate Charge• Tighter VSD Specifications• Avalanche Energy SpecifiedApplication• Switch Mode Power Supplies• PWM Motor Controls• Converters• Bridge Circuits...
NTB10N40: Features: • Higher Current Rating• Lower R DS(on)• Lower Capacitances• Lower Total Gate Charge• Tighter VSD Specifications• Avalanche Energy SpecifiedApplication&...
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Rating |
Symbol |
Value |
Unit |
DrainSource Voltage |
VDSS |
400 |
Vdc |
DrainGate Voltage (RGS = 1.0 M ) |
VDGR |
400 |
Vdc |
GateSource Voltage Continuous NonRepetitive (tp10 ms) |
VGS VGSM |
±20 ±40 |
Vdc |
Drain Continuous Continuous @ 100°C Single Pulse (tp10 ms) |
ID I D IDM |
10 7.5 35 |
Adc |
Total Power Dissipation Derate above 25°C |
PD |
142 1.14 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
°C |
Single DraintoSource Avalanche Energy Starting TJ = 25°C (VDD = 100 Vdc, VGS = 10 Vdc, IL = 10 A, L = 10 mH, RG = 25 ) |
EAS |
500 |
mJ |
Thermal Resistance JunctiontoCase JunctiontoAmbient JunctiontoAmbient (Note 1.) |
R JC R JA RJA |
0.88 62.5 50 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL |
260 |
°C |
1. When surface mounted to an FR4 board using the minimum recommended pad size.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
NTB10N40 is designed for high voltage, high speed switching applications in power supplies, converters, power motor controls and bridge circuits.