Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for better RF performance• HIGH GAIN BANDWIDTH PRODUCT: fT = 9.5 GHz• LOW NOISE FIGURE: NF = 1.7...
NE688M23: Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for bett...
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• NEW MINIATURE M23 PACKAGE:
World's smallest transistor package footprint
leads are completely underneath package body
Low profile/0.55 mm package height
Ceramic substrate for better RF performance
• HIGH GAIN BANDWIDTH PRODUCT: fT = 9.5 GHz
• LOW NOISE FIGURE: NF = 1.7 dB at 2 GHz
• HIGH COLLECTOR CURRENT: IC MAX = 100 mA
SYMBOLS |
PARAMETERS |
UNITS |
RATINGS |
VCEO |
Collector to Emitter Voltage |
V |
9 |
VCBO |
Collector to Base Voltage |
V |
6 |
VEBO |
Emitter to Base Voltage |
V |
2 |
IC |
Collector Current |
mA |
100 |
PT |
Total Power Dissipation |
mW |
TBD |
Tj |
Junction Temperature |
°C |
150 |
TSTG |
Storage Temperature |
°C |
-65 to +125 |
The NE688M23 transistor is designed for low cost amplifier and oscillator applications. Low noise figure, high gain and high current capability equate to wide dynamic range and excellent linearity. NEC's new low profile/ceramic substrate style "M23" package is ideal for today's portable wireless applications. The NE688M23 is also available in chip and six different low cost plastic surface mount package styles.