NE687M23 Selling Leads, Price trend, NE687M23 DataSheet download, circuit diagram from SeekIC.com

Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for better RF performance• HIGH GAIN BANDWIDTH PRODUCT: fT = 5.5 GHz• LOW NOISE FIGURE: NF = 1.5...

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NE687M23: Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for bett...

NE687M23 Data Sheet

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Part Number:: NE687M23
Supply Ability:: 5000

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1~5000

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Negotiable

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15 Days

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Upload time: 2025/1/8

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Recent History
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Product Details

Description

Features:

• NEW MINIATURE M23 PACKAGE:
World's smallest transistor package footprint
leads are completely underneath package body
Low profile/0.55 mm package height
Ceramic substrate for better RF performance
• HIGH GAIN BANDWIDTH PRODUCT: fT = 5.5 GHz
• LOW NOISE FIGURE: N_F = 1.5 dB at 2 GHz

Specifications

SYMBOLS	PARAMETERS	UNITS	RATINGS
V_CEO	Collector to Emitter Voltage	V	5
V_CBO	Collector to Base Voltage	V	3
V_EBO	Emitter to Base Voltage	V	2
I_C	Collector Current	mA	30
PT	Total Power Dissipation	mW	TBD
T_j	Junction Temperature	°C	150
T_STG	Storage Temperature	°C	-65 to +125

Note:
1. Operation in excess of any one of these parameters may result in permanent damage.

Description

The NE687M23 transistor is designed for low noise, high gain, and low cost requirements. This high fT part is well suited for very low voltage/low current designs for portable wireless communications and cellular radio applications. NEC's new low profile/ceramic substrate style "M23" package is ideal for today's portable wireless applications. The NE687M23 is also available in six different low cost plastic surface mount package styles.

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NE687M23

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