NDH8502P

MOSFET DISC BY MFG 2/02

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NDH8502P Picture
SeekIC No. : 00161277 Detail

NDH8502P: MOSFET DISC BY MFG 2/02

floor Price/Ceiling Price

Part Number:
NDH8502P
Mfg:
Fairchild Semiconductor
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/9

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Product Details

Quick Details

Transistor Polarity : P-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : +/- 20 V Continuous Drain Current : 2.2 A
Resistance Drain-Source RDS (on) : 110 mOhms Configuration : Dual Dual Drain
Maximum Operating Temperature : + 150 C Mounting Style : SMD/SMT
Package / Case : SuperSOT-8 Packaging : Reel    

Description

Gate-Source Breakdown Voltage : +/- 20 V
Mounting Style : SMD/SMT
Packaging : Reel
Drain-Source Breakdown Voltage : 30 V
Transistor Polarity : P-Channel
Maximum Operating Temperature : + 150 C
Configuration : Dual Dual Drain
Continuous Drain Current : 2.2 A
Resistance Drain-Source RDS (on) : 110 mOhms
Package / Case : SuperSOT-8


Features:

` -2.2 A, -30 V. RDS(ON) = 0.11 @ VGS = -10 V RDS(ON) = 0.18 @ VGS = -4.5 V.
` Proprietary SuperSOTTM-8 package design using copper lead frame for superior thermal and electrical capabilities.
` High density cell design for extremely low RDS(ON).
` Exceptional on-resistance and maximum DC current capability.



Pinout

  Connection Diagram


Specifications

Symbol
Parameter
NDH8502P
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage - Continuous
-30
±20
-2.2
-10
0.8
-55 to 150
V
V
A
W

°C
ID
Drain Current Continuous Pulsed (Note 1)
PD
Maximum Power Dissipation (Note 1 )
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
</table
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1)
(Note 1)

156
40

°C/W
°C/W



Description

SuperSOTTM-8 P-Channel enhancement mode power field effect transistors NDH8502P are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. NDH8502P is particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast high-side switching, and low in-line power loss are needed in a very small outline surface mount package.




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