Features: • Robust High Voltage Termination• Avalanche Energy Specified• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode• Diode is Characterized for Use in Bridge Circuits• IDSS and VDS(on) Specified at Elevated TemperatureSpecifications...
MTV16N50E: Features: • Robust High Voltage Termination• Avalanche Energy Specified• SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode• Diode is Characterize...
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Features: • Robust High Voltage Termination• Avalanche Energy Specified• Sourcet...
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
500 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
500 |
Vdc |
GatetoSource Voltage - Continuous |
VGS |
± 20 |
Vdc |
Drain Current - Continuous - Continuous @ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
16 9.0 60 |
Adc Apk |
Total Power Dissipation Derate above 25°C Total Power Dissipation @ TC = 25°C (1) |
PD |
180 1.4 2.0 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
°C |
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =50Vdc,VGS = 10Vdc, Vdc,Peak IL =16Apk, L = 6.7mH, RG = 25) |
EAS |
860 |
mJ |
Thermal Resistance - Junction to Cas - Junction to Case - Junction to Ambient(1) |
RJC RJA RJA |
0.7 62.5 35 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |