Features: New Features of TMOS V• Onresistance Area Product about Onehalf that of Standard MOSFETs with New Low Voltage, Low RDS(on) Technology• Faster Switching than EFET PredecessorsFeatures Common to TMOS V and TMOS EFETS• Avalanche Energy Specified• IDSS and VDS(on) Spe...
MTD20N06V: Features: New Features of TMOS V• Onresistance Area Product about Onehalf that of Standard MOSFETs with New Low Voltage, Low RDS(on) Technology• Faster Switching than EFET PredecessorsFe...
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New Features of TMOS V
• Onresistance Area Product about Onehalf that of Standard MOSFETs with New Low Voltage, Low RDS(on) Technology
• Faster Switching than EFET Predecessors
Features Common to TMOS V and TMOS EFETS
• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Static Parameters are the Same for both TMOS V and TMOS EFET
• Surface Mount Package Available in 16 mm 13inch/2500 Unit Tape & Reel,Add T4 Suffix to Part Number
Rating |
Symbol |
Value |
Unit |
DrainSource Voltage |
VGSS |
60 |
Vdc |
DrainGate Voltage (RGS = 1.0 M) |
VDGR |
60 |
Vdc |
GateSource Voltage - Continuous - NonRepetitive (tp10ms) |
VGS VGSM |
±20 ±25 |
|
Drain - Continuous - Continuous @ 100°C - Single Pulse (tp10 s) |
ID ID IDM |
20 13 70 |
Adc Apk |
Total Power Dissipation Derate above 25°C Total Power Dissipation @ TA = 25°C, when mounted to minimum recommended pad size |
PD |
60 0.4 2.1 |
Watts W/°C Watts |
Operating and Storage Temperature Range |
TJ,Tstg |
55 to 175 |
°C |
Single DraintoSource Avalanche Energy - Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, IL = 20 Apk, L = 1.0 mH, RG = 25) |
EAS |
200 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient - Junction to Ambient(1) |
RJC RJA RJA |
2.5 100 71.4 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL |
260 |
°C |