Features: .REFRACTORY\GOLD METALLIZATION .RUGGEDIZED VSWR 25:1 .INTERNAL INPUT/OUTPUT MATCHING .LOW THERMAL RESISTANCE .METAL/CERAMIC HERMETIC PACKAGE ·POUT = 400 W MIN. WITH 6.5 dB GAINSpecifications Symbol Parameter Value Unit PDISS Power Dissipation*(TC 80°C) 1000 W IC ...
MSC81400M: Features: .REFRACTORY\GOLD METALLIZATION .RUGGEDIZED VSWR 25:1 .INTERNAL INPUT/OUTPUT MATCHING .LOW THERMAL RESISTANCE .METAL/CERAMIC HERMETIC PACKAGE ·POUT = 400 W MIN. WITH 6.5 dB GAINSpecificatio...
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Symbol | Parameter |
Value |
Unit |
PDISS | Power Dissipation*(TC 80°C) |
1000 |
W |
IC | Device Current* |
28 |
A |
VCC | Collector-Supply Voltage* |
55 |
V |
TJ | Junction Temperature (Pulsed RF Operation) |
250 |
|
TSTG | Storage Temperature |
65 to 200 |
The MSC81400M "Super Power" transistor is a high peak pulse power device specifically designed for DME/TACAN avionics applications.
This MSC81400M is capable of withstanding a minimum 25:1 load mismatch condition at any phase angle under full rated conditions.
The MSC81400M is housed in the unique BIGPAC ™ hermetic metal/ceramic package with internal input/output matching structures.