Features: . REFRACTORY/GOLD METALLIZATION . EMITTER SITE BALLASTED . :1 VSWR CAPABILITY . LOW THERMAL RESISTANCE. INPUT MATCHING . OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC PACKAGE` POUT = 35 W MIN. WITH 10.7 dB GAINSpecifications Symbol Parameter Value Unit PDISS Power Dissipation...
MSC81035M: Features: . REFRACTORY/GOLD METALLIZATION . EMITTER SITE BALLASTED . :1 VSWR CAPABILITY . LOW THERMAL RESISTANCE. INPUT MATCHING . OVERLAY GEOMETRY . METAL/CERAMIC HERMETIC PACKAGE` POUT = 35 W MIN....
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. REFRACTORY/GOLD METALLIZATION
. EMITTER SITE BALLASTED
. :1 VSWR CAPABILITY
. LOW THERMAL RESISTANCE
. INPUT MATCHING
. OVERLAY GEOMETRY
. METAL/CERAMIC HERMETIC PACKAGE
` POUT = 35 W MIN. WITH 10.7 dB GAIN
Symbol | Parameter |
Value |
Unit |
PDISS | Power Dissipation* (TC 100°C) |
150 |
W |
IC | Device Current* |
3.0 |
A |
VCC | Collector-Supply Voltage (Pulsed RF Operation) |
55 |
V |
TJ | Junction Temperature |
250 |
|
TSTG | Storage Temperature |
65 to 200 |
The MSC81035M is a medium power Class C transistor designed specifically for pulsed L-Band avionics applications. This device is a direct replacement for the MSC1035M. MSC81035M offers improved saturated ouput power and collector efficiency based on the test circuit described erein.
Low RF thermal resistance and computerized automatic wire bonding techniques ensure high reliability and product consistency.
The MSC81035M is housed in the IMPAC™ package with internal input matching.