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MSAFA75N10C

Features: • Ultrafast body diode• Increased Unclamped Inductive Switching (UIS) capability• Hermetically sealed, surface mount power package• Very low package inductance• Very low thermal resistance• Reverse polarity available upon requestApplication• DC-D...

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SeekIC No. : 004427532 Detail

MSAFA75N10C: Features: • Ultrafast body diode• Increased Unclamped Inductive Switching (UIS) capability• Hermetically sealed, surface mount power package• Very low package inductance̶...

MSAFA75N10C Data Sheet

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Part Number:
MSAFA75N10C
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

• Ultrafast body diode
• Increased Unclamped Inductive Switching (UIS) capability
• Hermetically sealed, surface mount power package
• Very low package inductance
• Very low thermal resistance
• Reverse polarity available upon request


Application

• DC-DC converters
• Motor controls
• Uninterruptible Power Supply(UPS)
• DC choppers
• Synchronous rectification
• Inverters


Specifications

Description Symbol Max. Unit
Drain-to-Source Voltage (Gate Shorted to Source) VDSS 100 Volts
Continuous Gate-to-Source Voltage VGS +/-30 Volts
Transient Gate-to-Source Voltage VGSM +/-40 Volts
Continuous Drain Current Tj= 25°C
Tj= 100°C		 ID25
ID100		 75
60		 Amps
Peak Drain Current, pulse width limited by TJmax IDM 300 Amps
Repetitive Avalanche Current IAR 75 Amps
Repetitive Avalanche Energy EAR 30 mJ
Single Pulse Avalanche Energy (3) EAS 1500 mJ
Total Power Dissipation @Tc=25°C PD 540 Watts
Junction Temperature Range Tj -55 to +150 °C
Storage Temperature Range Tstg -55 to+150 °C
Continuous Source Current (Body Diode) IS 75 Amps
Pulse Source Current (Body Diode) ISM 300 Amps
Thermal Resistance, Junction to Case JC 0.23 °C/W



Description

New generation N-channel enhancement mode power MOSFET MSAFA75N10C with rugged polysilicon gate structure and fast switching intrinsic rectifier. The very rugged Coolpack2TM surface-mount package is lightweight, space saving and hermetically sealed for high reliability and/or military/space application.




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