Features: · Low On-state resistance· Avalanche and Surge Rated· High Freq. Switching· Ultra Low Leakage Current· UIS rated· Available with Lot Acceptance Testing Spec MSAFA1N100DL, -L SuffixSpecifications SYMBOL PARAMETER VALUE UNIT VDSS Drain - Source Voltage 1000 Volts VGS Ga...
MSAFA1N100D: Features: · Low On-state resistance· Avalanche and Surge Rated· High Freq. Switching· Ultra Low Leakage Current· UIS rated· Available with Lot Acceptance Testing Spec MSAFA1N100DL, -L SuffixSpecif...
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Features: • Low On-State resistance• Avalanche and Surge Rated• High Frequency S...
Features: • Ultrafast body diode• Increased Unclamped Inductive Switching (UIS) capabi...
Features: · Ultrafast rectifier in parallel with the body diode (MSAE type only)· Rugged polysilic...
SYMBOL | PARAMETER | VALUE | UNIT |
VDSS | Drain - Source Voltage | 1000 | Volts |
VGS | Gate - Source Voltage | ±20 | Volts |
ID1 | Continuous Drain Current @ TC = 25 | 1 | Amps |
ID2 | Continuous Drain Current @ TC = 100 |
8 | Amps |
IDM1 |
Pulsed Collector Current @ TC = 25 | 4 | Amps |
IAR | Avalanche Current | 1 | Amps |
EAR | Repetitive Avalanche Energy | TBD | mJ |
EAS | Single Pulse Avalanche Energy | TBD | mJ |
TJ, TSTG | Operating and Storage: Junction Temperature Range | -55 to 150 |
The features of MSAFA1N100D:
` N-Channel enhancement mode high density MOSFET die
` Passivation: oxynitride, 4um
` Frontside (top) Metallization: Al/1%Cu for aluminum wire bonding, 9 um typical.
` Backside Metallization: Ti Ni (1 um) Ag (0.2 um) for soft solder attach