MPC8255 Selling Leads, Price trend, MPC8255 DataSheet download, circuit diagram from SeekIC.com

Features: The major features of the MPC8255 are as follows:• Footprint-compatible with the MPC8260• Dual-issue integer core- A core version of the EC603e microprocessor- System core microprocessor supporting frequencies of 150200 MHz- Separate 16-Kbyte data and instruction caches: Four...

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SeekIC No. : 004426098 Detail

MPC8255: Features: The major features of the MPC8255 are as follows:• Footprint-compatible with the MPC8260• Dual-issue integer core- A core version of the EC603e microprocessor- System core micr...

MPC8255 Data Sheet

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Part Number:: MPC8255
Supply Ability:: 5000

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Product Details

Description

Features:

The major features of the MPC8255 are as follows:
• Footprint-compatible with the MPC8260
• Dual-issue integer core
- A core version of the EC603e microprocessor
- System core microprocessor supporting frequencies of 150200 MHz
- Separate 16-Kbyte data and instruction caches:
Four-way set associative
Physically addressed
LRU replacement algorithm
- PowerPC architecture-compliant memory management unit (MMU)
- Common on-chip processor (COP) test interface
- High-performance (4.45.1 SPEC95 benchmark at 200 MHz; 280 Dhrystones MIPS at 200 MHz)
- Supports bus snooping for data cache coherency
- Floating-point unit (FPU)
• Separate power supply for internal logic (2.5 V in HiP3, 2.0 V in HiP4) and for I/O (3.3V)
• Separate PLLs for G2 core and for the CPM
- G2 core and CPM can run at different frequencies for power/performance optimization
- Internal core/bus clock multiplier that provides 1.5:1, 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
- Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1 ratios
• 64-bit data and 32-bit address 60x bus
- Bus supports multiple master designs
- Supports single- and four-beat burst transfers
- 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
- Supports data parity or ECC and address parity
• 32-bit data and 18-bit address local bus
- Single-master bus, supports external slaves
- Eight-beat burst transfers
- 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
• System interface unit (SIU)
- Clock synthesizer
- Reset controller
- Real-time clock (RTC) register
- Periodic interrupt timer
- Hardware bus monitor and software watchdog timer
- IEEE 1149.1 JTAG test access port
• Twelve-bank memory controller
- Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other userdefinable peripherals
- Byte write enables and selectable parity generation
- 32-bit address decodes with programmable bank size
- Three user programmable machines, general-purpose chip-select machine, and page-mode pipeline SDRAM machine
- Byte selects for 64 bus width (60x) and byte selects for 32 bus width (local)
- Dedicated interface logic for SDRAM
• CPU core can be disabled and the device can be used in slave mode to an external core
• Communications processor module (CPM)
- Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for communications protocols
- Interfaces to G2 core through on-chip 32-Kbyte dual-port RAM and DMA controller
- Serial DMA channels for receive and transmit on all serial channels
- Parallel I/O registers with open-drain and interrupt capability
- Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
- Two fast communications controllers (FCC1 and FCC2) supporting the following protocols:
10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII)
ATM-Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0 protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 16 K external connections
Transparent
HDLC-Up to T3 rates (clear channel)
- One multichannel controller (MCC2)
Handles 128 serial, full-duplex, 64-Kbps data channels. The MCC can be split into four subgroups of 32 channels each.
Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up to four TDM interfaces per MCC
- Four serial communications controllers (SCCs) identical to those on the MPC860, supporting the digital portions of the following protocols:
Ethernet/IEEE 802.3 CDMA/CS
HDLC/SDLC and HDLC bus
Universal asynchronous receiver transmitter (UART)
Synchronous UART
Binary synchronous (BISYNC) communications
Transparent
- Two serial management controllers (SMCs), identical to those of the MPC860
Provide management for BRI devices as general circuit interface (GCI) controllers in timedivision- multiplexed (TDM) channels
Transparent
UART (low-speed operation)
- One serial peripheral interface identical to the MPC860 SPI
- One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller)
Microwire compatible
Multiple-master, single-master, and slave modes
- Up to four TDM interfaces
Supports one group of four TDM channels
2,048 bytes of SI RAM
Bit or byte resolution
Independent transmit and receive routing, frame synchronization
Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary rate, Motorola interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM serial interfaces
- Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs, SMCs, and serial channels
- Four independent 16-bit timers that can be interconnected as two 32-bit timers

Specifications

Rating	Symbol	Value	Unit
Core supply voltage²	VDD	-0.3 2.5	V
PLL supply voltage²	VCCSYN	-0.3 2.5	V
I/O supply voltage³	V_DDH	-0.3 4.0	V
Input voltage⁴	VIN	GND(-0.3) 3.6	V
Junction temperature	T_j	120	°C
Storage temperature range	T_STG	(-55) (+150)	°C

1 Absolute maximum ratings are stress ratings only; functional operation (see
Table 2) at the maximums is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage.
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V at any time,
including during power-on reset.
3 Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no
more than 100 mSec. VDDH should not exceed VDD/VCCSYN by more than
2.5 V during normal operation.
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including
during power-on reset.

MPC8255

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