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MPC604E9QED

Specifications Characteristic Symbol Value Unit Core supply voltage Vdd -0.3 to 2.80 V PLL supply voltage AVdd 0.3 to 2.80 V I/O supply voltage OVdd 0.3 to 3.8 V Input voltage Vin 0.3 to 3.3 V Overshoot (with respect to system GND) Vovs 4.0 V Undershoot (w...

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MPC604E9QED: Specifications Characteristic Symbol Value Unit Core supply voltage Vdd -0.3 to 2.80 V PLL supply voltage AVdd 0.3 to 2.80 V I/O supply voltage OVdd 0.3 to 3.8 V Input v...

MPC604E9QED Data Sheet

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Part Number:
MPC604E9QED
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Specifications

Characteristic Symbol Value Unit
Core supply voltage Vdd -0.3 to 2.80 V
PLL supply voltage AVdd 0.3 to 2.80 V
I/O supply voltage OVdd 0.3 to 3.8 V
Input voltage Vin 0.3 to 3.3 V
Overshoot (with respect to system GND) Vovs 4.0 V
Undershoot (with respect to system GND) Vuns -0.45 V
Storage temperature range Tstg 55 to 150 °C
Notes:
1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress  ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed  may affect device reliability or cause permanent damage to the device.
2.  Caution : Power up/down sequence must be adhered to to avoid device damage. 
* The power-up sequence is GND, Vdd, OVdd
*The power-down sequence is OVdd, Vdd, GND  In either case the rule OVdd - Vdd  2.0V must be followed.
3. Caution: During system power-up, any 604e signal Ð VDDcore must not exceed 2.0V
4. Caution: 604e inputs are not 5V tolerant.


Description

package parameters for the 604e are provided in the following list. The package type is 21 mm, 256- lead ceramic ball grid array (CBGA).
Package outline 21 x 21 mm
Interconnects 255
Pitch 1.27 mm (50 mil)
Maximum module height 3.30 mm
Ball diameter 0.89 mm (35 mil)




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