Features: ·Fast rise and fall times-20 ns 1000 pF load·High output swing-20V·High output current drive- +1.5 amps·TTL compatible inputs·High rep rate-5 to 10 MHz depending on power dissipation·Low power consumption in MOS 0 state-2 mW·Drives to 0.4V of GND for RAM address driveSpecificationsV+ -...
MNDS0026-X: Features: ·Fast rise and fall times-20 ns 1000 pF load·High output swing-20V·High output current drive- +1.5 amps·TTL compatible inputs·High rep rate-5 to 10 MHz depending on power dissipation·Low p...
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Features: · Meets EIA Standard RS-422A and RS-485· Meets SCSI specifications· Designed for multipo...
Features: ·Meets EIA Standard RS-422A and RS-485·Meets SCSI specifications·Designed for multipoint...
SpecificationsA0-A7 Current Applied to Output in Low Output State (Io) ..........40mAA0-A7, B0-B7 ...
V+ - V Differential...............................................22V
Input Current................................................100mA
Input Voltage (Vin - V ).....................................5.5V
Peak Output Current........................................1.5A
Maximum Power Dissipation At 25 C
(Note 2)
Cavity Package (8-Pin) .............................1150 mW
Cavity Package (14-Pin) ...........................1380 mW
Header Package (8-Pin) ....................................TBD
Header Package (12-Pin) ..................................TBD
Operating Temperature Range.......-55 C to +125 C
Maximum Junction Temperature.....................150 C
Storage Temperature Range..........-65 C to +150 C
Lead Temperature (Soldering, 10 sec.)..........300 C
Thermal Resistance
ThetaJA
Cavity Package 8-Pin ................................130 C/W
Cavity Package 14-Pin ..............................110 C/W
Header Package 8-Pin ..............................230 C/W
Header Package 12-Pin ....................................TBD
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specification and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is
dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower.
DS00026 is a low cost monolithic high speed two phase MOS clock drivers and interface circuits. Unique circuit design provides both very high speed operation and the ability to drive large capacitive loads. The DS00026 accepts standard TTL outputs and converts them to MOS logic levels. They may be driven from standard 54/74 series and 54S/74S series gates and flip-flops or from drivers such as the DS8830 or MD7440. The DS0026 is intended for applications in which the output pulse width is logically controlled; i.e., the output pulse width is equal to the input pulse width.
The DS0026 is designed to fulfill a wide variety of MOS interface requirements. As a MOS clock driver for long silicon-gate shift registers, a single device can drive over 10k bits at 5 MHz. Six devices provide input address and precharge drive for a 8k by 16-bit 1103 RAM memory system. Information on the correct usage of the DS0026 in these as well as other systems is included in the application note AN-76.