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MF3513-J9CATXX

Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered interface·Write protect switch·68pin·Built-in auxiliary battery Application·Office automation·Data C...

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SeekIC No. : 004419356 Detail

MF3513-J9CATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·Electrostatic discharge protection to 15kV·Buffered i...

MF3513-J9CATXX Data Sheet

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Part Number:
MF3513-J9CATXX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size
·Electrostatic discharge protection to 15kV
·Buffered interface
·Write protect switch
·68pin
·Built-in auxiliary battery

 




Application

·Office automation
·Data Communication
·Computers
·Industrial
·Telecommunications
·Consumer


Specifications

Symbol
Parameter
Conditions
Ratings
Unit
Vcc
Supply voltage
With respect to GND
-0.3~6.0
V
V I
Input voltage
-0.3~Vcc+0.3
V
VO
Output voltage
0~Vcc
V
Topr1
Operating temperature 1
Read, Write Operation
0~60
°C
Topr2
Operating temperature 2
Data retention
0~60
°C
Tstg
Storage temperature
Excludes data retention
-20~70
°C



Description

capacities on a device approximately the size of a credit card (85.6mm´54mm´3.3mm). The MF3513-J9CATXX cards use a 8/16 bit data-bus. Available in 64KB, 128KB, 256KB, 512KB, 1 MB, 2 MB and 4 MB capacities, Mitsubishi's SRAM cards conform to the PC Card Standard. Mitsubishi achieved high density memory, while maintaining credit size by using a thin small outline packaging technology (TSOP). The MF3513-J9CATXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. The MF3513-J9CATXX TSOP, with external leads spaced on 20-mil centers, is over four times smaller than standard equivalent pin count surface-mount packages. This allows up to 8 memory ICs (plus interface circuitry) to be mounted in a card that in only 3.3mm thick.




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