MF3513-J8CATXX

Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·One to 8 memory ICs can be mounted in a card that is only 3.3mm thick·Electrostatic discharge protection to 15kV·Buffered interface·Write protect switch·...

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MF3513-J8CATXX Picture
SeekIC No. : 004419355 Detail

MF3513-J8CATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·One to 8 memory ICs can be mounted in a card that is ...

floor Price/Ceiling Price

Part Number:
MF3513-J8CATXX
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/11/26

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Product Details

Description



Features:

·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size
·One to 8 memory ICs can be mounted in a card that is only 3.3mm thick
·Electrostatic discharge protection to 15kV
·Buffered interface
·Write protect switch
·Attribute memory
·68pin
·Built-in auxiliary battery



Application

·Office automation
·Data Communication
·Computers
·Industrial
·Telecommunications
·Consumer



Specifications

Symbol
Parameter
Conditions
Ratings
Unit
Vcc
Supply voltage
With respect to GND
-0.3~6.0
V
V I
Input voltage
-0.3~Vcc+0.3
V
VO
Output voltage
0~Vcc
V
Topr1
Operating temperature 1
Read, Write Operation
0~60
°C
Topr2
Operating temperature 2
Data retention
0~60
°C
Tstg
Storage temperature
Excludes data retention
-20~70
°C



Description

Mitsubishi's Static RAM cards provide large memory capacities on a device approximately the size of a credit card (85.6mm´54mm´3.3mm). The MF3513-J8CATXX cards use a 8/16 bit data-bus. Available in 64KB, 128KB, 256KB, 512KB, 1 MB, 2 MB and 4 MB capacities, Mitsubishi's SRAM cards conform to the PC Card Standard. Mitsubishi achieved high density memory, while maintaining credit size by using a thin small outline packaging technology (TSOP). The MF3513-J8CATXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. The MF3513-J8CATXX TSOP, with external leads spaced on 20-mil centers, is over four times smaller than standard equivalent pin count surface-mount packages. This allows up to 8 memory ICs (plus interface circuitry) to be mounted in a card that in only 3.3mm thick.




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