Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·One to 8 memory ICs can be mounted in a card that is only 3.3mm thick·Electrostatic discharge protection to 15kV·Buffered interface·Write protect switch·...
MF3513-J8CATXX: Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with high reliability, without enlarging card size·One to 8 memory ICs can be mounted in a card that is ...
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Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Features: ·Uses TSOP (Thin Small Outline Package) to achieve very high memory density coupled with...
Symbol |
Parameter |
Conditions |
Ratings |
Unit |
Vcc |
Supply voltage |
With respect to GND |
-0.3~6.0 |
V |
V I |
Input voltage |
-0.3~Vcc+0.3 |
V | |
VO |
Output voltage |
0~Vcc |
V | |
Topr1 |
Operating temperature 1 |
Read, Write Operation |
0~60 |
°C |
Topr2 |
Operating temperature 2 |
Data retention |
0~60 |
°C |
Tstg |
Storage temperature |
Excludes data retention |
-20~70 |
°C |
Mitsubishi's Static RAM cards provide large memory capacities on a device approximately the size of a credit card (85.6mm´54mm´3.3mm). The MF3513-J8CATXX cards use a 8/16 bit data-bus. Available in 64KB, 128KB, 256KB, 512KB, 1 MB, 2 MB and 4 MB capacities, Mitsubishi's SRAM cards conform to the PC Card Standard. Mitsubishi achieved high density memory, while maintaining credit size by using a thin small outline packaging technology (TSOP). The MF3513-J8CATXX TSOP surpasses conventional memory card chip-on-board packaging technology where larger, surface-mount devices result in a tradeoff between card size and optimum memory density. The MF3513-J8CATXX TSOP, with external leads spaced on 20-mil centers, is over four times smaller than standard equivalent pin count surface-mount packages. This allows up to 8 memory ICs (plus interface circuitry) to be mounted in a card that in only 3.3mm thick.