MCM63Z819

PinoutSpecifications Rating Symbol Value Unit Notes Power Supply Voltage VDD 0.5 to 4.6 V I/O Supply Voltage VDDQ VSS 0.5 to VDD V 2 Input Voltage Relative to VSS forAny Pin Except VDD Vin.Vout 0.5 to VDD + 0.5 V 2 Input Voltage...

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MCM63Z819 Picture
SeekIC No. : 004417840 Detail

MCM63Z819: PinoutSpecifications Rating Symbol Value Unit Notes Power Supply Voltage VDD 0.5 to 4.6 V I/O Supply Voltage VDDQ VSS 0.5 to VDD V 2 Input Volt...

floor Price/Ceiling Price

Part Number:
MCM63Z819
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Pinout

  Connection Diagram


Specifications

Rating
Symbol
Value
Unit
Notes
Power Supply Voltage
VDD
0.5 to 4.6
V
I/O Supply Voltage
VDDQ
VSS 0.5 to VDD
V
2
Input Voltage Relative to VSS for
Any Pin Except VDD
Vin.Vout
0.5 to VDD + 0.5
V
2
Input Voltage (Three State I/O)
VIT
VSS 0.5 to
VDDQ + 0.5
V
2
Output Current (per I/O)
Iout
±20
mA
Package Power Dissipation
PD
1.3
W
3
Temperature Under Bias
Tbias
10 to 85
Storage Temperature
Tstg
55 to 125
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
2. This is a steadystate DC parameter that is in effect after the power supply has achieved its nominal operating level. Power sequencing is not necessary.
3. Power dissipation capability is dependent upon package characteristics and use environment. See Package Thermal Characteristics.



Description

The ZBT RAM is a 4Mbit synchronous fast static RAM designed to provide Zero Bus TurnaroundE. The ZBT RAM allows 100% use of bus cycles during backtoback read/write and write/read cycles. The MCM63Z737 (organized as 128K words by 36 bits) and the MCM63Z819 (organized as 256K words by 18 bits) are fabricated in Motorola's high performance silicon gate CMOS technology. This device integrates input registers, a 2bit address counter, and high speed SRAM onto a single monolithic circuit for reduced parts count in communication applications. Synchronous design allows precise cycle control with the use of an external clock (CK). CMOS circuitry reduces the overall power consumption of the integrated functions for greater reliability.

Addresses (SA), data inputs (DQ), and all control signals except output enable (G) and linear burst order (LBO) are clock (CK) controlled through positive edgetriggered noninverting registers.

Write cycles of the MCM63Z819 are internally selftimed and are initiated by the rising edge of the clock (CK) input. This feature eliminates complex offchip write pulse generation and provides increased timing flexibility for incoming signals.

For read cycles, a flowthrough SRAM allows output data to simply flow freely from the memory array.
• 3.3 V LVTTL and LVCMOS Compatible
• MCM63Z737/MCM63Z81910 = 10 ns Access/12 ns Cycle (83 MHz)
    MCM63Z737/MCM63Z81911 = 11 ns Access/15 ns Cycle (66 MHz)
    MCM63Z737/MCM63Z81915 = 15 ns Access/20 ns Cycle (50 MHz)
• Selectable Burst Sequencing Order (Linear/Interleaved)
• Internally SelfTimed Write Cycle
• SingleCycle Deselect
• Byte Write Control
• ADV Controlled Burst
• 100Pin TQFP Package




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