MCM63R736

NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.

The MCM63R736/818 is a 4Mbit synchronous late write fast static RAM designed to provide high performance in secondary cache and ATM switch,Telecom, and other high speed memory applications. The MCM63R818 (organized as 256K words by 18 bits), and the MCM63R736 (organized as 128K words by 36 bits) are fabricated in Motorola's high performance silicon gate copper CMOS technology.

The differential clock (CK) inputs control the timing of read/write operations of the RAM. At the rising edge of CK, all addresses, write enables, and synchronous selects are registered. An internal buffer and special logic enable the memory to accept write data on the rising edge of CK, a cycle after address and control signals.Read data is also driven on the rising edge of CK.

The RAM of the MCM63R736 uses HSTL inputs and outputs. The adjustable input trippoint (Vref) and output voltage (VDDQ) gives the system designer greater flexibility in optimizing system performance.The synchronous write and byte enables allow writing to individual bytes or the entire word.

The impedance of the output buffers of the MCM63R736 is programmable, allowing the outputs to match the impedance of the circuit traces which reduces signal reflections.
• Byte Write Control
• 2.5 V 5% to 3.3 V +10% Operation
• 2.375 V to 3.6 V Operation
• HSTL - I/O (JEDEC Standard JESD86 Class I Compatible)
• HSTL - User Selectable Input TripPoint
• HSTL - Compatible Programmable Impedance Output Drivers
• Register to Register Synchronous Operation
• Boundary Scan (JTAG) IEEE 1149.1 Compatible
• Differential Clock Inputs
• Optional x18 or x36 Organization
• MCM63R736/8183 = 3 ns
   MCM63R736/8183.3 = 3.3 ns
   MCM63R736/8183.7 = 3.7 ns
   MCM63R736/8184 = 4 ns
• Sleep Mode Operation (ZZ pin)
• 119Bump, 50 mil (1.27 mm) Pitch, 14mm x 22mm Flipped Chip Plastic Ball Grid Array (PBGA) Package