MBM29DL16XTE/BE70

Features: • 0.23 mm Process Technology• Simultaneous Read/Write operations (dual bank)-Multiple devices available with different bank sizes-(Refer to MBM29DL16XTE/BE Device Bank Divisions Table in nGENERAL DESCRIPTION)-Host system can program or erase in one bank, then immediately an...

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SeekIC No. : 004414071 Detail

MBM29DL16XTE/BE70: Features: • 0.23 mm Process Technology• Simultaneous Read/Write operations (dual bank)-Multiple devices available with different bank sizes-(Refer to MBM29DL16XTE/BE Device Bank Divisio...

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Part Number:
MBM29DL16XTE/BE70
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

• 0.23 mm Process Technology
• Simultaneous Read/Write operations (dual bank)
-Multiple devices available with different bank sizes
-(Refer to "MBM29DL16XTE/BE Device Bank Divisions Table" in nGENERAL DESCRIPTION)
-Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
-Zero latency between read and write operations
-Read-while-erase
-Read-while-program



Specifications

Parameter
Conditions
Rating
Units
Min
Max
Storage Temperature
Tstg
55
+125
°C
Ambient Temperature with Power Applied
TA
40
+85
°C
Voltage with Respect to Ground All Pins except
A9, OE, RESET *1, *2
VIN, VOUT
0.5
VCC+0.5
V
Power Supply Voltage *1
VCC
0.5
+4.0
V
A9, OE, and RESET *1, *3
VIN
0.5
+13.0
V
WP/ACC *1, *4
VACC
0.5
+10.5
V



Description

The MBM29DL16XTE/BE70 are a 16M-bit, 3.0 V-only Flash memory organized as 2M bytes of 8 bits each or 1M words of 16 bits each. The MBM29DL16XTE/BE are offered in a 48-pin TSOP(1) and 48-ball FBGA Package. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and  5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers.

MBM29DL16XTE/BE70 are organized into two banks, Bank 1 and Bank 2, which are considered to be two separate memory arrays for operations. It is the Fujitsu's standard 3 V only Flash memories with the additional capability of allowing a normal non-delayed read access from a non-busy bank of the array while an embedded write (either a program or an erase) operation is simultaneously taking place on the other bank. In the MBM29DL16XTE/BE, a new design concept is implemented, so called "Sliding Bank Architecture". Under this concept, the MBM29DL16XTE/BE70 can be produced a series of devices with different Bank 1/Bank 2 size combinations; 0.5 Mb/15.5 Mb, 2 Mb/14 Mb, 4 Mb/12 Mb, 8 Mb/8 Mb.

The standard MBM29DL16XTE/BE offer access times 70 ns and 90 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable (WE), and output enable (OE) controls. The MBM29DL16XTE/BE70 are pin and command set compatible with JEDEC standard E2PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the devices is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.

The MBM29DL16XTE/BE70 are programmed by executing the program command sequence. This will invoke the Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the devices automatically time the erase pulse widths and verify proper cell margin.

A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.) The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29DL16XTE/BE are erased when shipped from the factory.

MBM29DL16XTE/BE70 feature single 3.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7, by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been completed, the devices internally reset to the read mode.

Fujitsu's Flash technology combines years of EPROM and E2PROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29DL16XTE/BE70 memories electrically erase the entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a time using the EPROM programming mechanism of hot electron injection.




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