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MB25W

Features: · High Conductivity· Metal Case· Superior Thermal Design· Surge Ratings to 400A· Terminals Solderable per MIL-STD-202, Method 208· Universal Terminals; Snap-on, Solder or P.C. Board MountingSpecificationsRating at 25 ambient temperature unless otherwise specified. Characteristic ...

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MB25W: Features: · High Conductivity· Metal Case· Superior Thermal Design· Surge Ratings to 400A· Terminals Solderable per MIL-STD-202, Method 208· Universal Terminals; Snap-on, Solder or P.C. Board Mounti...

MB25W Data Sheet

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Part Number:
MB25W
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· High Conductivity
· Metal Case
· Superior Thermal Design
· Surge Ratings to 400A
· Terminals Solderable per MIL-STD-202,
    Method 208
· Universal Terminals; Snap-on, Solder or P.C.
    Board Mounting


Specifications

Rating at 25 ambient temperature unless otherwise specified.
Characteristic Symbol -05 -1 -2 -4 -6 -8 -10 Units
Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V
Maximum Average MB15 I(AV) 15.0 A
Rectified Output Current MB25 25.0
@ TC = 55 MB35 35.0
Peak Forward Surge Current Single MB15 IFSM 300 A
Half Sine-Wave Superimposed on MB25 300
Rated Load (JEDEC Method) MB35 400
Maximum Instantaneous @ 7.5A MB15 VF 1.1 V
Forward Voltage Drop per @12.5A MB25 1.1
Rated Load (JEDEC Method) @17.5A MB35 1.2
Maximum Reverse DC current at Rated @TA= 25C IR 10 A
DC Blocking Voltage (per Element) @TA = 100 1.0 mA
I2t rating for fusing (8.3ms) MB15 I2t 373 A2s

 

 MB25 373

 

 MB35 664
Typical Thermal Resistance (Note 1) RJC 2.5 /W
Operating and Storage Temperature Range TJ, TSTG -55 to +150



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