Features: · High Conductivity· Metal Case· Superior Thermal Design· Surge Ratings to 400A· Terminals Solderable per MIL-STD-202, Method 208· Universal Terminals; Snap-on, Solder or P.C. Board MountingSpecificationsRating at 25 ambient temperature unless otherwise specified. Characteristic ...
MB25: Features: · High Conductivity· Metal Case· Superior Thermal Design· Surge Ratings to 400A· Terminals Solderable per MIL-STD-202, Method 208· Universal Terminals; Snap-on, Solder or P.C. Board Mounti...
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Features: Surge overload 200 - 400 Amp peakLow forward voltage droMounting position: AnyElectrical...
Characteristic | Symbol | -05 | -1 | -2 | -4 | -6 | -8 | -10 | Units | |
Maximum Recurrent Peak Reverse Voltage | VRRM | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V | |
Maximum RMS Voltage | VRMS | 35 | 70 | 140 | 280 | 420 | 560 | 700 | V | |
Maximum DC Blocking Voltage | VDC | 50 | 100 | 200 | 400 | 600 | 800 | 1000 | V | |
Maximum Average | MB15 | I(AV) | 15.0 | A | ||||||
Rectified Output Current | MB25 | 25.0 | ||||||||
@ TC = 55 | MB35 | 35.0 | ||||||||
Peak Forward Surge Current Single | MB15 | IFSM | 300 | A | ||||||
Half Sine-Wave Superimposed on | MB25 | 300 | ||||||||
Rated Load (JEDEC Method) | MB35 | 400 | ||||||||
Maximum Instantaneous @ 7.5A | MB15 | VF | 1.1 | V | ||||||
Forward Voltage Drop per @12.5A | MB25 | 1.1 | ||||||||
Rated Load (JEDEC Method) @17.5A | MB35 | 1.2 | ||||||||
Maximum Reverse DC current at Rated | @TA= 25C | IR | 10 | A | ||||||
DC Blocking Voltage (per Element) | @TA = 100 | 1.0 | mA | |||||||
I2t rating for fusing (8.3ms) | MB15 | I2t | 373 | A2s | ||||||
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MB25 | 373 | ||||||||
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MB35 | 664 | ||||||||
Typical Thermal Resistance (Note 1) | RJC | 2.5 | /W | |||||||
Operating and Storage Temperature Range | TJ, TSTG | -55 to +150 |