MA4P1250 Selling Leads, Price trend, MA4P1250 DataSheet download, circuit diagram from SeekIC.com

Features: ·Non-Rollable MELF Design·Hermetically Sealed·Low Loss, Low Distortion·Passivated PIN Diode Chips·Ful·Face Chip Bonds·Non-Magnetic Package·Pick and Place CompatibilityApplicationThe MA4P1250 is designed for use as a low loss switching element from HF through UHF. Its high power rating al...

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SeekIC No. : 004407896 Detail

MA4P1250: Features: ·Non-Rollable MELF Design·Hermetically Sealed·Low Loss, Low Distortion·Passivated PIN Diode Chips·Ful·Face Chip Bonds·Non-Magnetic Package·Pick and Place CompatibilityApplicationThe MA4P12...

MA4P1250 Data Sheet

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Part Number:: MA4P1250
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Upload time: 2024/11/27

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Recent History
What is this?

MA4P evaluate
Features: High Power HandlingLow Loss, Low DistortionVoltage Ratings to 1000 VoltsPassivated PIN C...
MA4P1200NM-401T evaluate
US $3.9 - 5.85 / Piece

PIN Diodes Vr 100 Vdc Max 1.5pF Rs= .75 Ohms Max.
MA4P1250-1072T evaluate
US $1.5 - 2.25 / Piece

PIN Diodes .1-1500MHz .9pF Max Vr 500Vdc

Product Details

Description

Features:

·Non-Rollable MELF Design
·Hermetically Sealed
·Low Loss, Low Distortion
·Passivated PIN Diode Chips
·Ful·Face Chip Bonds
·Non-Magnetic Package
·Pick and Place Compatibility

Application

The MA4P1250 is designed for use as a low loss switching element from HF through UHF. Its high power rating allows performance in antenna switch elements at RF power levels greater than 100 watts CW.

It is designed to meet the low distortion requirements of mobile radios. The MA4P1450 is a higher power diode. It has lower distortion at RF CW power greater than 10 watts and can dissipate 7.5 watts.

Specifications

Parameter	Absolute Maximum
Voltage Operating Temperature Storage Temperature	50 Volts -65°C to + 175°C -65°C to +175°C
Power Dissipation Free Air Contact Surfaces @ +25°C	1.5 Watts 4.0 Watts

Description

The MA4P1250 and MA4P1450 are square surface mountable PIN diodes in a non-rollable, metal electrode leadless faced (MELF) package. They incorporate passivated PIN diode chips that are full face bonded to refractory metal pins. These parts utilize M/A-COM's HIPAX technology in a low inductance ceramic package with no ribbons or whisker wires. The package is hermetically sealed at temperatures exceeding 300°C.

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MA4P1250

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