MA4P

Features: High Power HandlingLow Loss, Low DistortionVoltage Ratings to 1000 VoltsPassivated PIN Chip Full Face BondedHermetically SealedLow Inductance Axial Lead, and SMQSurface Mount Package OptionsAvailable as ChipsApplication The semiconductor technology utilized in the HIPAX family draws on ...

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SeekIC No. : 004407895 Detail

MA4P: Features: High Power HandlingLow Loss, Low DistortionVoltage Ratings to 1000 VoltsPassivated PIN Chip Full Face BondedHermetically SealedLow Inductance Axial Lead, and SMQSurface Mount Package Opti...

floor Price/Ceiling Price

Part Number:
MA4P
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

High Power Handling
Low Loss, Low Distortion
Voltage Ratings to 1000 Volts
Passivated PIN Chip Full Face Bonded
Hermetically Sealed
Low Inductance Axial Lead, and SMQ
Surface Mount Package Options
Available as Chips



Application

  The semiconductor technology utilized in the HIPAX family draws on M/A-COM's substantial experience in PIN diode design. This results in thick intrinsic region PIN diodes specified with low resistance, low capacitance and long carrier lifetime parameters.




Specifications

Parameter Absolute Maximum
DC Reverse Voltage Voltage Rating
Operating and Storage Temperature -65 to +175
Installation Temperature +250, 30 Seconds



Description

  M/A-COM's HIPAX PIN diodes MA4P are designed for service in switch and attenuator applications requiring high power handling and low distortion. HIPAX PIN diodes incorpo-rate a fully passivated PIN diode chip resulting in extremely low reverse leakage current. all high voltage HIPAX PIN diodes are specified at 1 A reverse current at the voltage rating. The chip is full face bonded to refrac-tory metal pins on both anode and cathode. The result is a low loss PIN diode with low thermal resistance due to symmetrical thermal paths.

  HIPAX PIN diodes MA4P are packaged in hermetically sealed ceramic enclosures at temperatures exceeding 300°C. Package options include: axial leaded and surface mount packages that have a square, nonrollable outline.

  The semiconductor technology utilized in the HIPAX family draws on M/A-COM's substantial experience in PIN diode design. This results in thick intrinsic region PIN diodes specified with low resistance, low capacitance and long carrier lifetime parameters.




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