MA4BN1840-2

Features: · Broad Bandwidth Specified for 18 to 40 GHz· Useable from 15 GHz to 50 GHz· Extremely Low Insertion Loss· High RF-DC Isolation· Rugged, Fully Monolithic, Glass Encapsulated ConstructionApplicationThe MA4BN1840-2 millimeter frequency bias network is suitable for D.C. biasing PIN Diode co...

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SeekIC No. : 004407852 Detail

MA4BN1840-2: Features: · Broad Bandwidth Specified for 18 to 40 GHz· Useable from 15 GHz to 50 GHz· Extremely Low Insertion Loss· High RF-DC Isolation· Rugged, Fully Monolithic, Glass Encapsulated ConstructionAp...

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Part Number:
MA4BN1840-2
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

· Broad Bandwidth Specified for 18 to 40 GHz
· Useable from 15 GHz to 50 GHz
· Extremely Low Insertion Loss
· High RF-DC Isolation
· Rugged, Fully Monolithic, Glass Encapsulated Construction



Application

The MA4BN1840-2 millimeter frequency bias network is suitable for D.C. biasing PIN Diode control circuits as a RF- DC
de-coupling network, a conventional Bias Tee, and as a D.C.

Return network. The device can also be used as a bi-directional re-active coupler for schottky detector circuits. D.C. currents up to 150 mA and D.C. voltages up to 50 V may be used




Specifications

Operating Temperature ...............-65 °C to +125 °C
Storage Temperature ..................-65 °C to +150 °C
RF C.W. Incident Power ...............................10 Watts
D.C. Bias Current ......................................+/- 150 mA
D.C. Bias Voltage ..........................................+/- 50 V
Die Attach Temperature ................320 °C for 20 sec
1. Exceeding any of these values may result in permanent damage



Description

The MA4BN1840-2 device is a fully monolithic broadband bias network utilizing M/A-COM's HMIC TM (Heterolithic Microwave Integrated Circuit) Process, US Patent 5,268,310. This process allows the incorporation of silicon pedestals that form vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high performance with exceptional repeatability through millimeter frequencies.

MA4BN1840-2 Large bond pads facilitate the use of low inductance ribbon bonds,while gold backside metalization allows for manual or automatic die attach via 80Au/20Sn or Sn62/Pb36/Ag2 solders or electrically conductive silver epoxy.




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