Features: ` SUPPLY VOLTAGEVDD = VDDQ = 1.65V to 2.2V for Program,Erase and ReadVPP = 12V for fast Program (optional)` ASYNCHRONOUS PAGE MODE READ Page Width: 4 Words Page Access: 35ns Random Access: 85ns, 100ns and 120ns` PROGRAMMING TIME 10µs by Word typical Double Word Program Option` MEMO...
M59DR032EB: Features: ` SUPPLY VOLTAGEVDD = VDDQ = 1.65V to 2.2V for Program,Erase and ReadVPP = 12V for fast Program (optional)` ASYNCHRONOUS PAGE MODE READ Page Width: 4 Words Page Access: 35ns Random Access:...
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Symbol | Parameter | Value | Unit |
TA | Ambient Operating Temperature (1) | 40 to 85 | V |
TBIAS | Temperature Under Bias | 40 to 125 | V |
TSTG | Storage Temperature | 55 to 155 | V |
VIO (2) | Input or Output Voltage | 0.5 to VDDQ+0.5 | |
VDD, VDDQ | Supply Voltage | 0.5 to 2.7 | |
VPP | Program Voltage | 0.5 to 13 |
The M59DR032E is a 32 Mbit (2Mbit x16) non-vol- atile Flash memory that may be erased electrically at block level and programmed in-system on a Word-by-Word basis using a 1.65V to 2.2V VDD supply for the circuitry and a 1.65V to 2.2V VDDQ supply for the Input/Output pins. An optional 12V VPP power supply is provided to speed up custom- er programming.
The device M59DR032E features an asymmetrical block archi- tecture. M59DR032E has an array of 71 blocks and is divided into two banks, Banks A and B, pro-viding Dual Bank operations. While programming or erasing in Bank A, read operations are possible in Bank B or vice versa. Only one bank at a time is allowed to be in program or erase mode. The bank architecture is summarized in Table 2, and the Block Addresses are shown in Appendix A. The Parameter Blocks are located at the top of the memory address space for the M59DR032EA,and at the bottom for the M59DR032EB.
Each block M59DR032E can be erased separately. Erase can be suspended, in order to perform either read or program in any other block, and then resumed. Each block can be programmed and erased over 100,000 cycles.
M59DR032E Program and Erase commands are written to the Command Interface of the memory. An internal Program/Erase Controller takes care of the tim- ings necessary for program and erase operations.
The end of a program or erase operation can be detected and any error conditions identified in the Status Register. The command set required to control the memory is consistent with JEDEC stan- dards.
The M59DR032E features an instant, individual block locking scheme that allows any block to be locked or unlocked with no latency, enabling in- stant code and data protection. All blocks have two levels of protection. They can be individually locked and locked-down preventing any acciden- tal programming or erasure. All blocks are locked at Power Up and Reset.
The device M59DR032E includes a 128 bit Protection Register and a Security Block to increase the protection of a system's design. The Protection Register is di- vided into two 64 bit segments. The first segment contains a unique device number written by ST, while the second one is one-time-programmable by the user. The user programmable segment can be permanently protected. The Security Block, pa-rameter block 0, can be permanently protected by the user. Figure 4, shows the Security Block and Protection Register Memory Map.
The device M59DR032E is available in TFBGA48 (7 x 12mm and 7 x 7mm, 0.75mm pitch) packages and it is supplied with all the bits erased (set to '1').