M29F200T

Features: 5V±10% SUPPLYVOLTAGEfor PROGRAM,ERASE and READ OPERATIONSFASTACCESS TIME: 55nsFASTPROGRAMMING TIME 10ms by Byte / 16ms by Word typicalPROGRAM/ERASE CONTROLLER (P/E.C.) Program Byte-by-Byte or Word-by-Word Status Register bits and Ready/Busy OutputMEMORY BLOCKS Boot Block (Top or Bottom l...

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M29F200T Picture
SeekIC No. : 004404382 Detail

M29F200T: Features: 5V±10% SUPPLYVOLTAGEfor PROGRAM,ERASE and READ OPERATIONSFASTACCESS TIME: 55nsFASTPROGRAMMING TIME 10ms by Byte / 16ms by Word typicalPROGRAM/ERASE CONTROLLER (P/E.C.) Program Byte-by-Byte...

floor Price/Ceiling Price

Part Number:
M29F200T
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/27

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Product Details

Description



Features:

5V±10% SUPPLYVOLTAGEfor PROGRAM,
ERASE and READ OPERATIONS
FASTACCESS TIME: 55ns
FASTPROGRAMMING TIME
10ms by Byte / 16ms by Word typical
PROGRAM/ERASE CONTROLLER (P/E.C.)
Program Byte-by-Byte or Word-by-Word
Status Register bits and Ready/Busy Output
MEMORY BLOCKS
Boot Block (Top or Bottom location)
Parameter and Main blocks
BLOCK, MULTI-BLOCK and CHIP ERASE
MULTI-BLOCKPROTECTION/TEMPORARY
UNPROTECTION MODES
ERASE SUSPEND and RESUME MODES
Read and Program another Block during
Erase Suspend
LOW POWER CONSUMPTION
Stand-byand Automatic Stand-by
100,000 PROGRAM/ERASE CYCLES per
BLOCK
20 YEARSDATARETENTION
Defectivity below 1ppm/year
ELECTRONIC SIGNATURE
Manufacturer Code: 0020h
Device Code, M29F200T: 00D3h



Pinout

  Connection Diagram


Specifications


Parameter
Value
SYMBOL
UNIT
Ambient Operating Temperature (Temperature Range Option 3)
40 to 125
TA
°C

Temperature Under Bias
50 to 125
TBIAS
°C

Storage Temperature

65 to 150
TSTG

Input or Output Voltage
0.6 to 6
VIO(2)
V
Supply Voltage
0.6 to 6
VCC
V
A9, E, G, RP Voltage
0.6 to 13.5
V(A9, E, G, RP)(2)
V


Notes:
1. Except for the rating "Operating Temperature Range", stresses above those listed in the Table AbsoluteMaximum Ratings" may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not i mplied. Exposure to Absolute MaximumRating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and otherrelevant quality documents.
2. Minimum Voltage may undershoot to 2V during transition and for less than 20ns.
3. Depends on range.




Description

The M29F200T is a non-volatile memory that may be erased electrically at the block or chip level and programmedin-system ona Byte-by-ByteorWordby- Word basis using only a single 5V VCC supply. For Program and Erase operations the necessary high voltages are generated internally. The device can also be programmed in standard programmers.

The array matrix organisation M29F200T allows each block to be erased and reprogrammed without affecting other blocks. Blocks can be protected against programing and erase on programming equipment, and temporarily unprotected to make changes in the application.




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