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KQB3N30

Features: `3.2A, 300 V. R DS(ON) = 2.2 @ VGS = 10 V`Low gate charge (typical 5.5nC)`Low Crss(typical 6.0pF)`Fast switching`100% avalanche tested`lmproved dv/dt capabilitySpecifications Parameter Symbol Rating Unit Drain to Source Voltage VDSS 300 V Drain Current ...

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SeekIC No. : 004386818 Detail

KQB3N30: Features: `3.2A, 300 V. R DS(ON) = 2.2 @ VGS = 10 V`Low gate charge (typical 5.5nC)`Low Crss(typical 6.0pF)`Fast switching`100% avalanche tested`lmproved dv/dt capabilitySpecifications Parame...

KQB3N30 Data Sheet

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Part Number:
KQB3N30
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

`3.2A, 300 V. R DS(ON) = 2.2 @ VGS = 10 V
`Low gate charge (typical 5.5nC)
`Low Crss(typical 6.0pF)
`Fast switching
`100% avalanche tested
`lmproved dv/dt capability


Specifications

Parameter
Symbol
Rating
Unit
Drain to Source Voltage
VDSS
300
V
Drain Current Continuous (TC=25 )
ID
3.2
A
Drain Current Continuous (TC=100 )
2.20
A
Drain Current Pulsed *1
IDM
12.8
A
Gate-Source Voltage
VGSS
±30
V
Single Pulsed Avalanche Energy*2
EAS
140
mJ
Avalanche Current *1
IAR
3.2
A
Repetitive Avalanche Energy *1
EAR
5.5
mJ
Peak Diode Recovery dv/dt *3
dv/dt
4.5
V/ns
Power dissipation @ TA=25
PD
3.13
W
Power dissipation @ TC=25 Derate above 25
PD
55
W
0.44
W/
Operating and Storage Temperature
TJ, TSTG
-55 to150
Maximum lead temperature for soldering
purposes,1/8" from case for 5 seconds
TL
300
Thermal Resistance Junction to Case
R JC
2.27
/W
Thermal Resistance Junction to Ambient *4
R JC
40
/W
Thermal Resistance Junction to Ambient
R JC
62.5
/W
*1 Repetitive Rating:Pulse width limited by maximum junction temperature
*2 l=22.5mH,IAS=3.2A,VDD=50V,RG=25 ,Startion TJ=25
*3 ISD3.2A,di/dt200A/ ,VDD BVDSS,Startiong TJ=25
*4 When mounted on the minimum pad size recommended (PCB Mount)


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