Features: · Voltage Supply- 1.8V device(K9F12XXQ0A) : 1.70~1.95V- 3.3V device(K9F12XXU0A) : 2.7 ~ 3.6 V· Organization- Memory Cell Array- X8 device(K9F1208X0A) : (64M + 2048K)bit x 8 bit- X16 device(K9F1216X0A) : (32M + 1024K)bit x 16bit- Data Register- X8 device(K9F1208X0A) : (512 + 16)bit x 8bit...
K9F1208U0A-VCB0: Features: · Voltage Supply- 1.8V device(K9F12XXQ0A) : 1.70~1.95V- 3.3V device(K9F12XXU0A) : 2.7 ~ 3.6 V· Organization- Memory Cell Array- X8 device(K9F1208X0A) : (64M + 2048K)bit x 8 bit- X16 device...
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Features: · Voltage Supply- 2.65V device(K9F12XXD0A) : 2.4~2.9V- 3.3V device(K9F12XXU0A) : 2.7 ~ 3...
Features: · Voltage Supply- 1.8V device(K9F56XXQ0C) : 1.70~1.95V- 3.3V device(K9F56XXU0C) : 2.7 ~ ...
Features: · Voltage Supply- 1.8V device(K9F1208Q0B) : 1.70~1.95V- 2.65V device(K9F1208D0B) : 2.4~2...
Parameter | Symbol | Rating | Unit | ||
K9F12XXQ0A(1.8V) | K9F12XXU0A(3.3V) | ||||
Voltage on any pin relative to VSS | VIN/OUT | -0.6 to + 2.45 | -0.6 to + 4.6 | V | |
VCC | -0.6 to + 2.45 | -0.6 to + 4.6 | |||
VCCQ | -0.6 to + 2.45 | -0.6 to + 4.6 | |||
Temperature Under Bias | K9E2G08B0M-XCB0 | TBIAS | -10 to +125 | ||
K9E2G08B0M-XIB0 | -40 to +125 | ||||
Storage Temperature | K9E2G08B0M-XCB0 | TSTG | -65 to +150 | ||
K9E2G08B0M-XIB0 | |||||
Short Circuit Current | IOS | 5 | mA |
NOTE :
1. Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns. Maximum DC voltage on input/output pins is VCC,+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Offered in 64Mx8bit or 32Mx16bit, the K9F1208U0A-VCB0 is 512M bit with spare 16M bit capacity. The K9F1208U0A-VCB0 is offered in 1.8V or 3.3V Vcc. Its NAND cell provides the most cost-effective solutIon for the solid state mass storage market. A program operation can be performed in typical 200ms on the 528-byte(X8 device) or 264-word(X16 device) page and an erase operation can be performed in typical 2ms on a 16K-byte(X8 device) or 8K-word(X16 device) block. Data in the page can be read out at 50ns cycle time per word.
The I/O pins serve as the ports for address and data input/output as well as command input. The on-chip write control automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. Even the write-intensive systems can take advantage of the K9F12XXX0A¢s extended reliability of 100K program/erase cycles by providing ECC(Error Correcting Code) with real time mapping-out algorithm.
The K9F1208U0A-VCB0 is an optimum solution for large nonvolatile storage applications such as solid state file storage and other portable applications requiring non-volatility.