K5D5657ACM-F015

Features: <Common>· Operating Temperature : -25°C ~ 85°C· Package : 107-ball FBGA Type - 10.5x13mm, 0.8mm pitch<NAND>· Power Supply Voltage : 1.7~1.95V· Organization- Memory Cell Array : (32M + 1024K)bit x 8bit- Data Register : (512 + 16)bit x 8bit· Automatic Program and Erase- Page Pr...

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SeekIC No. : 004383112 Detail

K5D5657ACM-F015: Features: <Common>· Operating Temperature : -25°C ~ 85°C· Package : 107-ball FBGA Type - 10.5x13mm, 0.8mm pitch<NAND>· Power Supply Voltage : 1.7~1.95V· Organization- Memory Cell Array :...

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Part Number:
K5D5657ACM-F015
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/15

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Product Details

Description



Features:

<Common>
· Operating Temperature : -25°C ~ 85°C
· Package : 107-ball FBGA Type - 10.5x13mm, 0.8mm pitch

<NAND>
· Power Supply Voltage : 1.7~1.95V
· Organization
- Memory Cell Array : (32M + 1024K)bit x 8bit
- Data Register : (512 + 16)bit x 8bit
· Automatic Program and Erase
- Page Program : (512 + 16)Byte
- Block Erase : (16K + 512)Byte
· Page Read Operation
- Page Size : (512 + 16)Byte
- Random Access : 10ms(Max.)
- Serial Page Access : 50ns(Min.)
· Fast Write Cycle Time
- Program time : 200ms(Typ.)
- Block Erase Time : 2ms(Typ.)
· Command/Address/Data Multiplexed I/O Port
· Hardware Data Protection
- Program/Erase Lockout During Power Transitions
· Reliable CMOS Floating-Gate Technology
- Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
· Command Register Operation
· Intelligent Copy-Back
· Unique ID for Copyright Protection

<Mobile SDRAM>
· Power Supply Voltage : 1.65~1.95V
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system clock.
• Burst read single-bit write operation.
• Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
-. DS (Driver Strength)
• DQM for masking.
• Auto refresh.
• 64ms refresh period (4K cycle).



Specifications

Parameter Symbol Rating Unit
Voltage on any pin relative to VSS VIN/OUT -0.6 to + 2.45 V
VCC -0.2 to + 2.45
VCCQ -0.2 to + 2.45
Temperature Under Bias TBIAS -40 to +125 °C
Storage Temperature TSTG -65 to +150 °C
Short Circuit Current Ios 5 mA

NOTE :
1.
Minimum DC voltage is -0.6V on input/output pins. During transitions, this level may undershoot to -2.0V for periods <30ns.
Maximum DC voltage on input/output pins is VCC,+0.3V which, during transitions, may overshoot to VCC+2.0V for periods <20ns.
2. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability




Description

The K5D5657ACM-F015 is a Multi Chip Package Memory which combines 256Mbit Nand Flash Memory and 256Mbit synchronous high data rate Dynamic RAM.

256Mbit NAND Flash memory K5D5657ACM-F015 is organized as 32M x8 bits and 256Mbit SDRAM is organized as 4M x16 bits x4 banks.In 256Mbit NAND Flash, a 528-Byte page program can be typically achieved within 200us and an 16K-Byte block erase can be typically achieved within 2ms. In serial read operation, a byte can be read by 50ns. DQ pins serve as the ports for address and data input/output as well as command inputs. Even the write-intensive systems can take advantage of FLASH¢s extended reliability of 100K program/erase cycles with real time mapping-out algorithm. These algorithms have been implemented in many mass storage applications.

In 256Mbit SDRAM, Synchronous design make a device K5D5657ACM-F015 controlled precisely with the use of system clock and I/O transactions are possible on every clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.

The K5D5657ACM-F015 is suitable for use in data memory of mobile communication system to reduce not only mount area but also power consumption. This K5D5657ACM-F015 is available in 107-ball FBGA Type.




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