Features: • Double-data-rate architecture; two data transfers per clock cycle• Bidirectional data strobe(DQS)• Four banks operation• Differential clock inputs(CK and CK)• DLL aligns DQ and DQS transition with CK transition• MRS cycle with address key programs -....
K4H280838F: Features: • Double-data-rate architecture; two data transfers per clock cycle• Bidirectional data strobe(DQS)• Four banks operation• Differential clock inputs(CK and CK)̶...
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Features: • Double-data-rate architecture; two data transfers per clock cycle• Bidirec...
Features: • Double-data-rate architecture; two data transfers per clock cycle• Bidirec...
Features: • Double-data-rate architecture; two data transfers per clock cycle• Bidirec...
Parameter |
Symbol |
Value |
Unit |
Voltage on any pin relative to VSS |
VIN, VOUT |
-0.5 ~ 3.6 |
V |
Voltage on VDD & VDDQ supply relative to VSS |
VDD, VDDQ |
-1.0 ~ 3.6 |
V |
Storage temperature |
TSTG |
-55 ~ +150 |
°C |
Power dissipation |
PD |
1.5 |
W |
Short circuit current |
IOS |
50 |
mA |
The K4H280438F / K4H280838F is 134,217,728 bits of double data rate synchronous DRAM organized as 4x 8,388,608 / 4x 4,194,304 words by 4/ 8bits, fabricated with SAMSUNGs high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 333Mb/s per pin. I/O transactions are possible on both edges of DQS. Range of operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications.