Features: • International standard package• Encapsulating epoxy meets UL 94 V-0, flammability classification• miniBLOC with Aluminium nitride isolation• Low RDS (on) HDMOSTM process• Rugged polysilicon gate cell structure• Unclamped Inductive Switching (UIS) rat...
IXFN 23N100: Features: • International standard package• Encapsulating epoxy meets UL 94 V-0, flammability classification• miniBLOC with Aluminium nitride isolation• Low RDS (on) HDMOSTM ...
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Features: • International standard package• Encapsulating epoxy meets UL 94 V-0, flamm...
Features: · RF capable MOSFETs· Double metal process for low gate resistance· Unclamped Inductive ...
Features: • International standard packages• JEDECTO-264 AA,epoxymeet UL 94 V-0, flamm...
VDSS VDGR |
TJ = 25 to 150 TJ = 25 to 150, RGS = 1M |
1000 1000 |
V V |
VGS VGSM |
Continuous Transient |
±20 ±30 |
V V |
ID25 | TC = 25 | 24N100 24 23N100 23 |
A A |
IDM | TC = 25; Note 1 | 24N100 96 23N100 92 |
A A |
IAR | TC = 25 | 24 | A |
EAR EAS |
TC = 25 TC = 25 |
60 3 |
mJ J |
dv/dt | IS IDM, di/dt 100 A/s, VDD VDSS TJ 150, RG = 2 |
5 | V/ns |
PD | TC = 25 | 600 | W |
TJ TJM Tstg |
-55 ... +150 150 -55 ... +150 |
||
TL | 1.6 mm (0.063 in) from case for 10 s | 300 | |
VISOL | 50/60 Hz, RMS t = 1 min IISOL 1 mA t = 1 s |
2500 3000 |
V~ V~ |
Md | Mounting torque Terminal connection torque |
1.5/13 1.5/13 |
Nm/lb.in. Nm/lb.in. |
Weight | 30 | g |