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ITF87052SVT

Features: • Ultra Low On-Resistance - rDS(ON) = 0.0115, VGS = −10V - rDS(ON) = 0.120, VGS = −4.5V - rDS(ON) = 0.190, VGS = −4V• 2.5 V Gate Drive Capability• Simulation Models - Temperature Compensated PSPICE™ and SABER Electrical Models - Spice and SABER T...

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ITF87052SVT: Features: • Ultra Low On-Resistance - rDS(ON) = 0.0115, VGS = −10V - rDS(ON) = 0.120, VGS = −4.5V - rDS(ON) = 0.190, VGS = −4V• 2.5 V Gate Drive Capability• Simul...

ITF87052SVT Data Sheet

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Part Number:
ITF87052SVT
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Ultra Low On-Resistance
   - rDS(ON) = 0.0115, VGS = −10V
   - rDS(ON) = 0.120, VGS = −4.5V
   - rDS(ON) = 0.190, VGS = −4V
• 2.5 V Gate Drive Capability
• Simulation Models
   - Temperature Compensated PSPICE™ and SABER Electrical Models
   - Spice and SABER Thermal Impedance Models
   - www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting Area
• Switching Time vs RGS Curves 


Specifications

    ITF87052SVT UNITS
Drain to Source Voltage (Note 1)
VDSS
-20
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
-20
V
Gate to Source Voltage
VGS
-12/+6
V
Drain Current
Continuous (TA = 25, VGS = -4.5V) (Note 2)
Continuous (TA = 25, VGS = -4.0V) (Note 2)
Continuous (TA = 100, VGS = -4.0V) (Note 2)
Continuous (TA = 100, VGS = -2.5V) (Note 2)
Pulsed Drain Current

ID
ID
ID
ID
IDM


3.0
3.0
1.5
1.5
Figure 4

A
A
A
A
A
Power Dissipation (Note 2)
Derate Above 25
PD
2.5
16
W
mW/
Operating and Storage Temperature
TJ, TSTG
-55 to 150
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s
Package Body for 10s, See Technical Brief TB370

TL
Tpkg

300
260


NOTES:
1. TJ = 25 to 125.
2. 62.5/W measured using FR-4 board with 0.40 in2 (258.1 mm2) copper pad at 2 second.

CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.


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