Features: • Clock frequency: 167, 143, 133 MHz• Fully synchronous; all signals referenced to a positive clock edge• Internal bank for hiding row access/precharge• Power supplyVDD VDDQIS42S81600B 3.3V 3.3VIS42S16800B3.3V 3.3V• LVTTL interface• Programmable burst ...
IS42S81600B: Features: • Clock frequency: 167, 143, 133 MHz• Fully synchronous; all signals referenced to a positive clock edge• Internal bank for hiding row access/precharge• Power suppl...
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Features: • 256,144 words x 32 bits x 2-bank organization• All inputs are sampled at t...
• Clock frequency: 167, 143, 133 MHz
• Fully synchronous; all signals referenced to a positive clock edge
• Internal bank for hiding row access/precharge
• Power supply
VDD VDDQ
IS42S81600B 3.3V 3.3V
IS42S16800B3.3V 3.3V
• LVTTL interface
• Programmable burst length
(1, 2, 4, 8, full page)
• Programmable burst sequence: Sequential/Interleave
• Auto Refresh (CBR)
• Self Refresh with programmable refresh periods
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write operations capability
• Burst termination by burst stop and precharge command
• Industrial Temperature Availability
• Lead-free Availability
Symbol | Parameters |
Rating |
Unit |
VDD MAX | Maximum Supply Voltage |
0.5 to +4.6 |
V |
VDDQ MAX | Maximum Supply Voltage for Output Buffer |
0.5 to +4.6 |
V |
VIN | Input Voltage |
0.5 to VDD + 0.5 |
V |
VOUT | Output Voltage |
1.0 to VDDQ + 0.5 |
V |
PD MAX | Allowable Power Dissipation |
1 |
W |
ICS | Output Shorted Current |
50 |
mA |
TOPR | Operating Temperature Com. Ind. |
0 to +70 |
|
TSTG | Storage Temperature |
65 to +150 |
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. All voltages are referenced to Vss.
Symbol | Parameters |
Rating |
Unit |
VDD MAX | Maximum Supply Voltage |
0.5 to +4.6 |
V |
VDDQ MAX | Maximum Supply Voltage for Output Buffer |
0.5 to +4.6 |
V |
VIN | Input Voltage |
0.5 to VDD + 0.5 |
V |
VOUT | Output Voltage |
1.0 to VDDQ + 0.5 |
V |
PD MAX | Allowable Power Dissipation |
1 |
W |
ICS | Output Shorted Current |
50 |
mA |
TOPR | Operating Temperature Com. Ind. |
0 to +70 |
|
TSTG | Storage Temperature |
65 to +150 |
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. All voltages are referenced to Vss.
The 128Mb SDRAM IS42S81600B is a high speed CMOS, dynamic random-access memory designed to operate in 3.3V VDD and 3.3V VDDQ memory systems containing 134,217,728 bits. Internally configured as a quad-bank DRAM with a synchronous interface. Each 33,554,432-bit bank is organized as 4,096 rows by 512 columns by 16 bits or 4,096 rows by 1,024 columns by 8 bits.
The 128Mb SDRAM IS42S81600B includes an AUTO REFRESH MODE, and a power-saving, power-down mode. All signals are registered on the positive edge of the clock signal, CLK. All inputs and outputs are LVTTL compatible.
The 128Mb SDRAM IS42S81600B has the ability to synchronously burst data at a high data rate with automatic column-address generation, the ability to interleave between internal banks to hide precharge time and the capability to randomly change column addresses on each clock cycle during burst access.
A self-timed row precharge initiated at the end of the burst sequence is available with the AUTO PRECHARGE function enabled. Precharge one bank while accessing one of the other three banks will hide the precharge cycles and provide seamless, high-speed, random-access operation.
SDRAM IS42S81600B read and write accesses are burst oriented starting at a selected location and continuing for a programmed number of locations in a programmed sequence. The registration of an ACTIVE command begins accesses, followed by a READ or WRITE command. The ACTIVE command in conjunction with address bits registered are used to select the bank and row to be accessed (BA0, BA1 select the bank; A0-A11 select the row). The READ or WRITE commands in conjunction with address bits registered are used to select the starting column location for the burst access.
Programmable READ or WRITE burst lengths consist of 1, 2, 4 and 8 locations or full page, with a burst terminate option.