Features: ·Ultra Low On-Resistance·P-Channel MOSFET·Surface Mount·Available in Tape & Reel·Lead-FreeSpecifications Symbol Parameter Max. Units VDS Drain- Source Voltage -20 V ID @ TA= 25 Continuous Drain Current, VGS @ -4.5V -5.6 A ID @ TA= 70 Continuous Drain Current, ...
IRLMS6802PbF: Features: ·Ultra Low On-Resistance·P-Channel MOSFET·Surface Mount·Available in Tape & Reel·Lead-FreeSpecifications Symbol Parameter Max. Units VDS Drain- Source Voltage -20 V ID...
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Symbol | Parameter | Max. | Units |
VDS | Drain- Source Voltage | -20 | V |
ID @ TA= 25 | Continuous Drain Current, VGS @ -4.5V | -5.6 | A |
ID @ TA= 70 | Continuous Drain Current, VGS @ -4.5V | -4.5 | A |
IDM | Pulsed Drain Current | -45 | A |
PD @ TA = 25 | Power Dissipation | 2.0 | W |
PD @ TA = 70 | Power Dissipation | 1.3 | W |
Linear Derating Factor | 0.016 | W/ | |
EAS | Single Pulse Avalanche Energy | 34 | mJ |
VGS | Gate-to-Source Voltage | ± 12 | V |
TJ, TSTG | Junction and Storage Temperature Range | -55 to + 150 |
These P-Channel MOSFETs from International Rectifier IRLMS6802PbF utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device IRLMS6802PbF for use in battery and load management applications.
The Micro6™ package with its customized leadframe produces a HEXFET® power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. The unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.