Specifications Parameter Max. Units VDS Drain- Source Voltage -20 V ID @ TA = 25°C Continuous Drain Current, VGS @ 10V4.5V -5.6 A ID @ TA = 100°C Continuous Drain Current, VGS @ 10V4.5V -4.5 IDM Pulsed Drain Current -45 PD @TA = 25°C Power Dissipation 2....
IRLMS6802: Specifications Parameter Max. Units VDS Drain- Source Voltage -20 V ID @ TA = 25°C Continuous Drain Current, VGS @ 10V4.5V -5.6 A ID @ TA = 100°C Continuous Drain Current,...
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Parameter | Max. | Units | |
VDS | Drain- Source Voltage | -20 | V |
ID @ TA = 25°C | Continuous Drain Current, VGS @ 10V4.5V | -5.6 | A |
ID @ TA = 100°C | Continuous Drain Current, VGS @ 10V4.5V | -4.5 | |
IDM | Pulsed Drain Current | -45 | |
PD @TA = 25°C | Power Dissipation | 2.0 | W |
PD @TA = 25°C | Power Dissipation | 1.3 | |
Linear Derating Factor | 0.016 | W/°C | |
EAS | Single Pulse Avalanche Energy | 31 | mJ |
VGS | Gate-to-Source Voltage | ±12 | V |
TJ TSTG | Junction and Storage Temperature Range | -55 to + 150 | °C |
These P-Channel MOSFETs from International Rectifier IRLMS6802 utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device IRLMS6802 for use in battery and load management applications.
The Micro6 package with its customized leadframeproduces a HEXFET power MOSFET with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. The unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.