Features: ·Ultra Low On-Resistance·P-Channel MOSFET·urface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain- Source Voltage -12 V ID @ TA = 25°C Continuous Drain Current, VGS @ -4.5V -5.5 A ID @ TA= 70°C Continuous...
IRLMS4502: Features: ·Ultra Low On-Resistance·P-Channel MOSFET·urface Mount·Available in Tape & ReelSpecifications Parameter Max. Units VDS Drain- Source Voltage -12 V I...
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Parameter |
Max. |
Units | |
VDS |
Drain- Source Voltage |
-12 |
V |
ID @ TA = 25°C |
Continuous Drain Current, VGS @ -4.5V |
-5.5 |
A |
ID @ TA= 70°C |
Continuous Drain Current, VGS @ -4.5V |
-4.4 | |
IDM |
Pulsed Drain Current |
-44 | |
PD @TA = 25°C |
Power Dissipation |
1.7 |
W |
PD @TA = 70°C |
Power Dissipation |
1.1 | |
Linear Derating Factor |
0.013 |
W/°C | |
EAS |
Single Pulse Avalanche Energy |
28 |
mJ |
VGS |
Gate-to-Source Voltage |
± 12 |
V |
TJ, TSTG |
Junction and Storage Temperature Range |
55 to + 150 |
°C |
These P-Channel MOSFETs from International Rectifier IRLMS4502 utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications..
The Micro6 package with its customized leadframe produces a HEXFET power MOSFET IRLMS4502 with Rds(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.