Features: Ultra Low On-ResistanceN-Channel MOSFET Surface Mount Available in Tape & Reel 2.5V RatedLead-FreeSpecifications Parameter Max. Units VDS Drain- Source Voltage 20 V ID @ TA = 25 Continuous Drain Current, VGS @ -4.5V 6.5 A ID @ TA= 70 Continuous D...
IRLMS2002PbF: Features: Ultra Low On-ResistanceN-Channel MOSFET Surface Mount Available in Tape & Reel 2.5V RatedLead-FreeSpecifications Parameter Max. Units VDS Drain- Source Voltage 20 ...
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Parameter |
Max. |
Units | |
VDS | Drain- Source Voltage |
20 |
V |
ID @ TA = 25 | Continuous Drain Current, VGS @ -4.5V |
6.5 |
A |
ID @ TA= 70 | Continuous Drain Current, VGS @ -4.5V |
5.2 | |
IDM | Pulsed Drain Current |
20 | |
PD @TA = 25 | Power Dissipation |
2.0 |
W |
PD @TA = 70 | Power Dissipation |
1.3 | |
Linear Derating Factor |
0.016 |
mW/ | |
VGS | Gate-to-Source Voltage |
±8 |
V |
TJ, TSTG | Junction and Storage Temperature Range |
-55 to +150 |
These N-Channel MOSFETs from International Rectifier IRLMS2002PbF utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.
The Micro6™ package with its customized leadframe produces a HEXFET® power MOSFET IRLMS2002PbF with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.