PinoutSpecifications Symbol Parameter Max. Units VDS Drain-Source Voltage -12 V ID @ TA = 25 Continuous Drain Current,VGS @ 10V -4.3 A ID @ TA = 70 Continuous Drain Current,VGS @ 10V -3.4 IDM Pulsed Drain Current -34 PD @TA = 25 Power Dissipation...
IRLML6401PbF: PinoutSpecifications Symbol Parameter Max. Units VDS Drain-Source Voltage -12 V ID @ TA = 25 Continuous Drain Current,VGS @ 10V -4.3 A ID @ TA = 70 Continuous D...
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Symbol |
Parameter |
Max. |
Units |
VDS | Drain-Source Voltage |
-12 |
V |
ID @ TA = 25 | Continuous Drain Current,VGS @ 10V |
-4.3 |
A |
ID @ TA = 70 | Continuous Drain Current,VGS @ 10V |
-3.4 | |
IDM | Pulsed Drain Current |
-34 | |
PD @TA = 25 |
Power Dissipation |
1.3 |
W |
PD @TA = 70 |
Power Dissipation |
0.8 |
W |
Linear Derating Factor |
0.01 |
W/ | |
EAS | Single Pulse Avalanche Energy |
33 |
mJ |
VGS | Gate-to-Source Voltage |
±8.0 |
V |
TJ, TSTG | Junction and Storage Temperature Range |
-55 TO +150 |
These P-Channel MOSFETs from International Rectifier IRLML6401PbF utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit of IRLML6401PbF, combined with the fast switching speed and ruggedized device design that HEXFET® power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in battery and load management.
A thermally enhanced large pad leadframe has been incorporated into the standard SOT-23 package to produce a HEXFET Power MOSFET with the industry's smallest footprint. This package, dubbed the Micro3, is ideal for applications where printed circuit board space is at a premium. The low profile (<1.1mm) of the Micro3 allows it to fit easily into extremely thin application environments such as portable electronics and PCMCIA cards. The thermal resistance and power dissipation are the best available.