IRLL024N

Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ 10V** 4.4 A ID @ TA = 25°C Continuous Drain Current, VGS @ 10V* 3.1 ID @ TA = 70°C Continuous Drain Current, VGS @ 10V* 2.5 IDM Pulsed Drain Current 12 PD @TA = 25°C Power ...

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SeekIC No. : 004378407 Detail

IRLL024N: Specifications Parameter Max. Units ID @ TA = 25°C Continuous Drain Current, VGS @ 10V** 4.4 A ID @ TA = 25°C Continuous Drain Current, VGS @ 10V* 3.1 ID @ TA = 70°C Conti...

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Part Number:
IRLL024N
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/6/11

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Product Details

Description



Specifications

Parameter Max. Units
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V** 4.4 A
ID @ TA = 25°C Continuous Drain Current, VGS @ 10V* 3.1
ID @ TA = 70°C Continuous Drain Current, VGS @ 10V* 2.5
IDM Pulsed Drain Current 12
PD @TA = 25°C Power Dissipation(PCB Mount)** 2.1 W
PD @TA = 25°C Power Dissipation(PCB Mount)* 1.0 W
Linear Derating Factor(PCB Mount)* 8.3 W/°C
VGS Gate-to-Source Voltage ±16 V
EAS Single Pulse Avalanche Energy 120 mJ
IAR Avalanche Current 3.1 A
EAR Repetitive Avalanche Energy* 0.1 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ TSTG Junction and Storage Temperature Range -55 to + 175 °C



Description

Fifth Generation HEXFETs from International Rectifier IRLL024N utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRLL024N design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The SOT-223 package of IRLL024N is designed for surface-mount using vapor phase, infra red, or wave soldering techniques.

Its unique package design allows for easy automatic pickand- place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application




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