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IRL3803VS

Features: · Logic-Level Gate Drive· Advanced Process Technology· Surface Mount (IRL3803VS)· Low-profile through-hole (IRL3803VL)· 175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSpecifications Parameter Max. Units ID @ TC = 25 Continuous Drain Current, VGS @ 10V 140...

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SeekIC No. : 004378328 Detail

IRL3803VS: Features: · Logic-Level Gate Drive· Advanced Process Technology· Surface Mount (IRL3803VS)· Low-profile through-hole (IRL3803VL)· 175°C Operating Temperature· Fast Switching· Fully Avalanche RatedSp...

IRL3803VS Data Sheet

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Part Number:
IRL3803VS
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Description



Features:

· Logic-Level Gate Drive
· Advanced Process Technology
· Surface Mount (IRL3803VS)
· Low-profile through-hole (IRL3803VL)
· 175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated


Specifications

  Parameter Max. Units
ID @ TC = 25 Continuous Drain Current, VGS @ 10V 140 A
ID @ TC = 100 Continuous Drain Current, VGS @ 10V 110
IDM Pulsed Drain Current 470
PD @TA = 25 Power Dissipation 3.8 W
PD @TC = 25 Power Dissipation 200 W
  Linear Derating Factor

1.4

 W/
VGS Diode Maximum Forward Current ±16 V
IAR Avalanche Current 71 A
EAR Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
TJ
TSTG		 Operating Junction and
Storage Temperature Range		 -55 to + 175
  Soldering Temperature, for 10 seconds 300 (1.6mm from case )



Description

Advanced HEXFET® Power MOSFETs from International Rectifier IRL3803VS utilize advanced processing techniques to achieve extremely low onresistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRL3803VS design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.




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