IRL3303LPBF

MOSFET MOSFT 30V 38A 26mOhm 17.3nC LogLvl

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SeekIC No. : 00150074 Detail

IRL3303LPBF: MOSFET MOSFT 30V 38A 26mOhm 17.3nC LogLvl

floor Price/Ceiling Price

US $ .49~1.22 / Piece | Get Latest Price
Part Number:
IRL3303LPBF
Mfg:
International Rectifier
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~25
  • 25~100
  • 100~250
  • Unit Price
  • $1.22
  • $.75
  • $.52
  • $.49
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Upload time: 2024/11/23

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Product Details

Quick Details

Transistor Polarity : N-Channel Drain-Source Breakdown Voltage : 30 V
Gate-Source Breakdown Voltage : 16 V Continuous Drain Current : 38 A
Resistance Drain-Source RDS (on) : 40 mOhms Mounting Style : Through Hole
Package / Case : TO-262 Packaging : Tube    

Description

Configuration :
Maximum Operating Temperature :
Transistor Polarity : N-Channel
Drain-Source Breakdown Voltage : 30 V
Mounting Style : Through Hole
Packaging : Tube
Gate-Source Breakdown Voltage : 16 V
Continuous Drain Current : 38 A
Package / Case : TO-262
Resistance Drain-Source RDS (on) : 40 mOhms


Features:






Specifications






Description

      The IRL3303LPbF and IRL3303SPbF has 8 features.The first one is logic-level gate drive.The second one is advanced process technology.The third one is surface mount (IRL3303S).The fourth one is low-profile through-hole(IRL3303L).The fifth one is 175  operating temperature.The sixth one is fast switch.The seventh one is fully avalanche rated.The eighth one is lead-free.
      Fifth generation HEXFETs from international rectifier IRL3303LPbF utilize advanced processing techniques to achieve extremely low on-resistance per silicon area.This benefit,combined with the fast switching speed and ruggedized device IRL3303LPbF design that HEXFET power MOSFETs are well know for,provides the designer with an extremely effcient and reliable device for use in a wide variety of applications.The D Pak IRL3303LPbF is a surface mount power package capable of accommodating die sizes up to HEX-4.The device IRL3303LPbF provides the highest power capability and the lowest possible on-resistance in any existing surface mount package.The D pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application.The through-hole version (IRL3303LPbF) is available for lowprofile applications.
      The IRL3303LPbF and IRL3303SPbF has some information about absolute maximum ratings.ID @ Tc =25 ,when parameter is continuous drain current,VGS @ 10V,the max is 38,the units is A.ID @ Tc =100 ,when parameter is continuous drain current,VGS @ 10V,the max is 27,the units is A.IDM,when parameter is pulsed drain current,the max is 140,the units is A.PD @ TA = 25,when parameter is power dissipation,the max is 3.8,the units is W.PD @ TA = 25,when parameter is power dissipation,the max is 68,the units is W/.
      At present there is not too much information about IRL3303LPbF.If you are willing to find more  about the IRL3303LPbF and IRL3303SPbF, please pay attention to our web! We will promptly update the relevant  information.

 






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