FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 30V
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Vgs(th) (Max) @ Id: 1V @ 250µA
Series: HEXFET®
Input Capacitance (Ciss) @ Vds: 870pF @ 25V
Gate Charge (Qg) @ Vgs: 26nC @ 4.5V
Packaging: Tube
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Current - Continuous Drain (Id) @ 25° C: 38A
Manufacturer: International Rectifier
Power - Max: 3.8W
Supplier Device Package: TO-262
Rds On (Max) @ Id, Vgs: 26 mOhm @ 20A, 10V
Specifications
|
Parameter |
Max. |
Units |
| ID @ TC = 25°C |
Continuous Drain Current, VGS @ 10V |
38 |
A |
| ID @ TC = 100°C |
Continuous Drain Current, VGS @ 10V |
27 |
|
| IDM |
Pulsed Drain Current |
140 |
|
| PD @TC = 25°C |
Power Dissipation |
3.8 |
W |
| PD @TC = 25°C |
Power Dissipation |
68 |
W |
|
Linear Derating Factor |
0.45 |
W/°C |
| VGS |
Gate-to-Source Voltage |
± 16 |
V |
| EAS |
Single Pulse Avalanche Energy |
130 |
mJ |
| IAR |
Avalanche Current |
20 |
A |
| EAR |
Repetitive Avalanche Energy |
6.8 |
mJ |
| dv/dt |
Peak Diode Recovery dv/dt |
5.0 |
V/ns |
TJ
TSTG |
Operating Junction and
Storage Temperature Range |
-55 to + 175 |
°C |
|
Soldering Temperature, for 10 seconds |
300 (1.6mm from case ) |
|
DescriptionFifth Generation HEXFETs from International Rectifier IRL3303L utilize advanced processing techniques to achieveextremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.
The D2Pak IRL3303L is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRL3303L provides thehighest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRL3303L is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.
The through-hole version (IRL3303L) is available for lowprofile applications
IRL3303L Data Sheet
