IRL3103L

FET Type: MOSFET N-Channel, Metal Oxide
Transistor Type: -
Current - Collector (Ic) (Max): -
FET Feature: Logic Level Gate
Drain to Source Voltage (Vdss): 30V
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Frequency - Transition: -
Vgs(th) (Max) @ Id: 1V @ 250µA
Series: HEXFET®
Packaging: Tube
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I²Pak, TO-262AA
Manufacturer: International Rectifier
Current - Continuous Drain (Id) @ 25° C: 64A
Gate Charge (Qg) @ Vgs: 33nC @ 4.5V
Power - Max: 94W
Supplier Device Package: TO-262
Rds On (Max) @ Id, Vgs: 12 mOhm @ 34A, 10V
Input Capacitance (Ciss) @ Vds: 1650pF @ 25V


Features:

· Advanced Process Technology
· Surface Mount (IRL3103S)
· Low-profile through-hole (IRL3103L)
· 175°C Operating Temperature
· Fast Switching
· Fully Avalanche Rated




Specifications

	Parameter	Max.	Units
ID @ TC = 25°C	Continuous Drain Current, VGS @ 10V	64	A
ID @ TC = 100°C	Continuous Drain Current, VGS @ 10V	45	A
IDM	Pulsed Drain Current	220	A
PD @TC = 25°C	Power Dissipation	94	W
	Linear Derating Factor	0.63	W/°C
VGS	Gate-to-Source Voltage	±16	V
EAS	Single Pulse Avalanche Energy	240	mJ
IAR	Avalanche Current	34	A
EAR	Repetitive Avalanche Energy	22	mJ
dv/dt	Peak Diode Recovery dv/dt	5.0	V/ns
TJ,TSTG	Operating Junction and Storage Temperature Range	-55 to + 150	°C
	Soldering Temperature, for 10 seconds	300 (1.6mm from case)	°C

Description

Advanced HEXFET® Power MOSFETs from International Rectifier IRL3103L utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device IRL3103L design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications.

The D2Pak IRL3103L is a surface mount power package capable of accommodating die sizes up to HEX-4. The IRL3103L  provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak IRL3103L  is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application.

The through-hole version (IRL3103L) is available for lowprofile applications.