Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @10V (Silicon Limited) 54 ID @ TC = 100°C Continuous Drain Current, VGS @10V 34 A IDM Pulsed Drain Current 220 PD @TA = 25°C Power Dissipation 2.0 PD @TC = 25...
IRL3103D2: Specifications Parameter Max. Units ID @ TC = 25°C Continuous Drain Current, VGS @10V (Silicon Limited) 54 ID @ TC = 100°C Continuous Drain Current, VGS @10V 34 A...
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Parameter |
Max. |
Units | |
ID @ TC = 25°C | Continuous Drain Current, VGS @10V (Silicon Limited) |
54 |
|
ID @ TC = 100°C | Continuous Drain Current, VGS @10V |
34 |
A |
IDM | Pulsed Drain Current |
220 |
|
PD @TA = 25°C | Power Dissipation |
2.0 |
|
PD @TC = 25°C | Power Dissipation |
70 |
W |
Linear Derating Factor |
0.56 |
W/°C | |
VGS | Gate-to-Source Voltage |
±16 |
V |
TJ TSTG |
Operating Junction and Storage Temperature Range |
-55 to + 175 |
°C |
Soldering Temperature, for 10 seconds |
300 (1.6mm from case) |
||
Mounting torque, 6-32 or M3 screw. |
10 lbf•in (1.1N•m) |
The FETKY family of copackaged HEXFET power MOSFETs and Schottky Diodes IRL3103D2 offer the designer an innovative board space saving solution for switching regulator applications. A low on resistance Gen 5 MOSFET with a low forward voltage drop Schottky diode and minimized component interconnect inductance and resistance result in maximized converter efficiencies.
The TO-220 package of IRL3103D2 is universally preferred for all commercial-industrial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 contribute to its wide acceptance throughout the industry.