IRKU105_16AS90

The Generation V of Add-A-pak module IRKU105_16AS90 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior me- chanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu baseplate IRKU105_16AS90 allow an easier mounting on the majority of heatsink with increased tolerance of sur-face roughness and improve thermal spread.The Generation V of AAP module IRKU105_16AS90 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRKU105_16AS90 are secured against axial pull- out: they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.