IRKU/V71

The Generation V of Add-A-pak module IRKU/V71 combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device.

The Cu baseplate IRKU/V71 allow an easier mounting on the majority of heatsink with increased tolerance of surface roughness and improve thermal spread.

The Generation V of AAP module IRKU/V71 is manufactured without hard mold, eliminating in this way any possible direct stress on the leads.

The electrical terminals IRKU/V71 are secured against axial pull-out:they are fixed to the module housing via a click-stop feature already tested and proved as reliable on other IR modules.